7.0 KiB
SMA 2026 English Pitch Deck Outline
Deck goal: answer Samsung Mobile Advance judges' three questions: innovation, value added to Samsung Mobile devices, and feasibility for a six-month PoC.
Recommended title:
Diamond Thermal Packaging Modules for Next-Generation Samsung Mobile Devices
Slide 1 - Cover
Title: Diamond Thermal Packaging Modules for Next-Generation Samsung Mobile Devices
Subtitle: Samsung Mobile Advance 2026 Proposal
Company: Suzhou Bozhi Jinzhuan Technology Co., Ltd.
Key message: from diamond thermal materials to evaluable mobile packaging modules.
Slide 2 - Project Summary
Headline: A six-month PoC to validate diamond-based heat spreading in mobile-scale packages.
Copy:
- We propose to develop and test diamond-based thermal packaging modules for Samsung Mobile use cases.
- The PoC will compare diamond heat spreaders / diamond-metal submounts against conventional thermal stacks under Samsung-defined power and space constraints.
- Final deliverables include sample coupons, one demonstrator module, test report, and integration recommendations.
Slide 3 - Why Samsung Mobile
Headline: Mobile innovation is becoming thermally constrained.
Three pressure points:
- On-device AI and high-performance APs increase local heat flux.
- XR, foldable and wearable devices have tighter thermal envelopes.
- Camera, sensor and optical modules require thermal stability, not only peak cooling.
SMA fit: AI, XR, Power, Foldable, Wearable, Sensors, Materials.
Slide 4 - Company Information
Headline: Bozhi Jinzhuan is an engineering platform for high-power chip thermal packaging.
Content:
- Core products: high-power chip thermal-management packaging materials and devices.
- Existing products: ceramic substrates, TEC substrates, laser heat sinks, optical communication substrates, sensor substrates.
- Manufacturing base: over 10,000 m2 manufacturing footprint in company PPT materials.
- Capability foundation: PVD, photolithography, electroplating, electroless plating, cutting, inspection and customized metallization.
Note: employee count, valuation and patent quantity should be checked before final external submission.
Slide 5 - Core Technology
Headline: The differentiator is the interface, not only the diamond.
Technology stack:
- Diamond / diamond-metal thermal material.
- Surface activation and metallization.
- Fine patterning and solder / bonding compatibility.
- Package-level thermal path design.
- Inspection, reliability feedback and manufacturing iteration.
Evidence points:
- Company process capability includes Ti, TiW, Ni, Cr, Cu, Ta sputtering and 5/5 um line/space capability in existing audit materials.
- Diamond project materials include ultra-thin CVD diamond heat spreaders, diamond package substrates and diamond-Cu composites.
Slide 6 - Two Integration Routes
Headline: Two practical routes for Samsung Mobile evaluation.
Route A: Chip-on-diamond submount
- Die mounted directly on metallized diamond substrate.
- Suitable for XR optical engine, laser/LED, sensor, high-power module.
- Output: diamond submount coupon with solder / wire-bond compatible metallization.
Route B: Diamond layer in thermal stack
- Diamond heat spreader or diamond-metal insert integrated with VC / graphite / TEC / frame.
- Suitable for AP hotspot, foldable thin space, wearable module.
- Output: thin diamond heat spreader coupon and stack-level thermal comparison.
Slide 7 - Performance Evidence
Headline: Literature and company data support a measurable thermal advantage.
Evidence:
- Company material deck: ultra-thin CVD diamond heat spreader, 10-150 um, 1600-1800 W/mK.
- Company material deck: diamond-Cu composite, 600-800 W/mK, CTE 5-10 ppm/K.
- Literature MD: copper-coated diamond/Cu SLM composite reached 336 W/mK at 1 vol.% diamond under optimized process parameters.
- Literature MD: CVD diamond membranes can be fabricated as free-standing films; metallization literature supports Au/Cr and Au/Ti-W adhesion and thermal processing windows.
- Competitor benchmark: Element Six and Coherent both position CVD diamond as a high-power-density thermal management solution.
Use caution: literature values are not direct product guarantees; they support feasibility and mechanism.
Slide 8 - Application Concept 1: AP / XR Hotspot
Headline: Reduce hotspot temperature without redesigning the entire thermal system.
Scenario:
- Heat source: AP / NPU / XR optical module.
- Constraint: high heat flux, thin z-height, limited spreading area.
- Proposed module: metallized diamond heat spreader or diamond-Cu submount between die and existing spreader path.
PoC test:
- Dummy heat source + baseline stack vs. diamond stack.
- Metrics: peak temperature, thermal resistance, temperature uniformity, thickness impact.
Slide 9 - Application Concept 2: Sensor / Camera / Wearable Stability
Headline: Use high thermal conductivity and low CTE to stabilize precision modules.
Scenario:
- Heat from AP, PMIC, camera actuator, optical engine or sensor readout can cause drift.
- Diamond package substrate can spread heat and reduce local thermal gradients.
PoC test:
- Sensor/camera module coupon with controlled heat source.
- Metrics: thermal gradient, module drift proxy, thermal cycling stability, warpage.
Slide 10 - Six-Month PoC Plan
Headline: A focused PoC with three evaluation gates.
Milestone 1 - Detailed design and review, Month 1-2:
- Select target use case with Samsung.
- Freeze baseline stack, dimensions, power condition and KPIs.
- Deliver design review package and sample drawings.
Milestone 2 - Sample build and early working review, Month 3-4:
- Fabricate diamond heat spreader / submount coupons.
- Complete metallization and assembly process.
- Deliver early thermal data and manufacturability feedback.
Milestone 3 - TRL 6/7 demonstrator, Month 5-6:
- Build final demonstrator module.
- Complete thermal comparison, reliability screening and integration recommendation.
- Demo to Samsung Mobile R&D.
Slide 11 - Samsung Support Required
Headline: We can execute independently; Samsung input will sharpen the PoC.
Requested support:
- Target device class and rough mechanical envelope.
- Baseline material stack or reference thermal coupon.
- Power map / heat source assumption for dummy testing.
- Loan device or non-confidential module sample if available.
- Review access to Samsung R&D thermal / packaging owner at milestone gates.
No dependency:
- The PoC can proceed with dummy heat source and public mechanical assumptions if device data is not available.
Slide 12 - Expected Value
Headline: A fast path to evaluate diamond thermal packaging inside Samsung Mobile architectures.
Expected Samsung value:
- Lower hotspot temperature under thin, constrained mobile geometry.
- More stable sensors, optical modules and power modules.
- New material option for AI, XR, foldable and wearable roadmaps.
- A manufacturing partner able to move from material coupons to package-level modules.
Closing:
We invite Samsung Mobile to co-define the most valuable target module and validate diamond thermal packaging within a six-month PoC.