63 lines
6.0 KiB
Markdown
63 lines
6.0 KiB
Markdown
# 路演图片调用清单
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本页只列精选图片。完整图片库见 [图片快速索引](../Sources/Images/图片快速索引.md)，缩略总览见 [幻灯片缩略图总览](../Sources/Images/幻灯片缩略图总览.md)。
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## 调用方式
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```text
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请调用 Image ID `{Image ID}`，查看对应图片笔记，
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并结合 Source PPT note 的 slide 文本确认上下文后用于路演。
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```
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## 公司与品牌
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| 用途 | Image ID | 本地路径 | 来源 |
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|---|---|---|---|
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| 中文公司封面 | `SLIDE-ppt03_company_intro_20250412-S001` | `../../assets/slides/ppt03_company_intro_20250412/slide-001.jpg` | [ppt03 S001](../Sources/PPT/ppt03_company_intro_20250412.md) |
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| 英文验厂封面 | `SLIDE-ppt02_apple_audit_product_intro-S001` | `../../assets/slides/ppt02_apple_audit_product_intro/slide-001.jpg` | [ppt02 S001](../Sources/PPT/ppt02_apple_audit_product_intro.md) |
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| 公司简介 | `SLIDE-ppt03_company_intro_20250412-S002` | `../../assets/slides/ppt03_company_intro_20250412/slide-002.jpg` | [ppt03 S002](../Sources/PPT/ppt03_company_intro_20250412.md) |
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| 荣誉与资质 | `SLIDE-ppt03_company_intro_20250412-S015` | `../../assets/slides/ppt03_company_intro_20250412/slide-015.jpg` | [ppt03 S015](../Sources/PPT/ppt03_company_intro_20250412.md) |
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## 金刚石项目核心图
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| 用途 | Image ID | 本地路径 | 来源 |
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|---|---|---|---|
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| 芯片热管理痛点 | `SLIDE-ppt03_company_intro_20250412-S003` | `../../assets/slides/ppt03_company_intro_20250412/slide-003.jpg` | [ppt03 S003](../Sources/PPT/ppt03_company_intro_20250412.md) |
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| 封装结构与热路径 | `SLIDE-ppt03_company_intro_20250412-S004` | `../../assets/slides/ppt03_company_intro_20250412/slide-004.jpg` | [ppt03 S004](../Sources/PPT/ppt03_company_intro_20250412.md) |
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| 产品管线 | `SLIDE-ppt03_company_intro_20250412-S005` | `../../assets/slides/ppt03_company_intro_20250412/slide-005.jpg` | [ppt03 S005](../Sources/PPT/ppt03_company_intro_20250412.md) |
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| 陶瓷载板产品与场景 | `SLIDE-ppt03_company_intro_20250412-S006` | `../../assets/slides/ppt03_company_intro_20250412/slide-006.jpg` | [ppt03 S006](../Sources/PPT/ppt03_company_intro_20250412.md) |
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| DPC 载板流程与单晶/聚晶金刚石载板 | `SLIDE-ppt03_company_intro_20250412-S007` | `../../assets/slides/ppt03_company_intro_20250412/slide-007.jpg` | [ppt03 S007](../Sources/PPT/ppt03_company_intro_20250412.md) |
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| 金刚石-金属复合材料、散热垫片、新一代封装材料 | `SLIDE-ppt03_company_intro_20250412-S009` | `../../assets/slides/ppt03_company_intro_20250412/slide-009.jpg` | [ppt03 S009](../Sources/PPT/ppt03_company_intro_20250412.md) |
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## 制造与工程化
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| 用途 | Image ID | 本地路径 | 来源 |
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|---|---|---|---|
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| 生产能力矩阵 | `SLIDE-ppt03_company_intro_20250412-S010` | `../../assets/slides/ppt03_company_intro_20250412/slide-010.jpg` | [ppt03 S010](../Sources/PPT/ppt03_company_intro_20250412.md) |
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| 技术优势五宫格 | `SLIDE-ppt03_company_intro_20250412-S011` | `../../assets/slides/ppt03_company_intro_20250412/slide-011.jpg` | [ppt03 S011](../Sources/PPT/ppt03_company_intro_20250412.md) |
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| 生产设备 | `SLIDE-ppt03_company_intro_20250412-S012` | `../../assets/slides/ppt03_company_intro_20250412/slide-012.jpg` | [ppt03 S012](../Sources/PPT/ppt03_company_intro_20250412.md) |
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| 研发检验设备 | `SLIDE-ppt03_company_intro_20250412-S013` | `../../assets/slides/ppt03_company_intro_20250412/slide-013.jpg` | [ppt03 S013](../Sources/PPT/ppt03_company_intro_20250412.md) |
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| 英文过程能力 | `SLIDE-ppt02_apple_audit_product_intro-S009` | `../../assets/slides/ppt02_apple_audit_product_intro/slide-009.jpg` | [ppt02 S009](../Sources/PPT/ppt02_apple_audit_product_intro.md) |
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| 英文工艺流 1 | `SLIDE-ppt02_apple_audit_product_intro-S014` | `../../assets/slides/ppt02_apple_audit_product_intro/slide-014.jpg` | [ppt02 S014](../Sources/PPT/ppt02_apple_audit_product_intro.md) |
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| 英文工艺流 2 | `SLIDE-ppt02_apple_audit_product_intro-S015` | `../../assets/slides/ppt02_apple_audit_product_intro/slide-015.jpg` | [ppt02 S015](../Sources/PPT/ppt02_apple_audit_product_intro.md) |
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## MEMS 基地与项目计划
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| 用途 | Image ID | 本地路径 | 来源 |
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| MEMS 基地封面 | `SLIDE-ppt01_mems_sensor_base_plan-S001` | `../../assets/slides/ppt01_mems_sensor_base_plan/slide-001.jpg` | [ppt01 S001](../Sources/PPT/ppt01_mems_sensor_base_plan.md) |
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| MEMS 市场格局 | `SLIDE-ppt01_mems_sensor_base_plan-S004` | `../../assets/slides/ppt01_mems_sensor_base_plan/slide-004.jpg` | [ppt01 S004](../Sources/PPT/ppt01_mems_sensor_base_plan.md) |
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| MEMS 产品矩阵 | `SLIDE-ppt01_mems_sensor_base_plan-S007` | `../../assets/slides/ppt01_mems_sensor_base_plan/slide-007.jpg` | [ppt01 S007](../Sources/PPT/ppt01_mems_sensor_base_plan.md) |
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| MEMS 技术路线 | `SLIDE-ppt01_mems_sensor_base_plan-S008` | `../../assets/slides/ppt01_mems_sensor_base_plan/slide-008.jpg` | [ppt01 S008](../Sources/PPT/ppt01_mems_sensor_base_plan.md) |
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| 封装工艺路线 | `SLIDE-ppt01_mems_sensor_base_plan-S011` | `../../assets/slides/ppt01_mems_sensor_base_plan/slide-011.jpg` | [ppt01 S011](../Sources/PPT/ppt01_mems_sensor_base_plan.md) |
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| 封装测试能力 | `SLIDE-ppt01_mems_sensor_base_plan-S012` | `../../assets/slides/ppt01_mems_sensor_base_plan/slide-012.jpg` | [ppt01 S012](../Sources/PPT/ppt01_mems_sensor_base_plan.md) |
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| 投资明细 | `SLIDE-ppt01_mems_sensor_base_plan-S016` | `../../assets/slides/ppt01_mems_sensor_base_plan/slide-016.jpg` | [ppt01 S016](../Sources/PPT/ppt01_mems_sensor_base_plan.md) |
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| 产能规划 | `SLIDE-ppt01_mems_sensor_base_plan-S018` | `../../assets/slides/ppt01_mems_sensor_base_plan/slide-018.jpg` | [ppt01 S018](../Sources/PPT/ppt01_mems_sensor_base_plan.md) |
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## 缩略图总览
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- `../../assets/contact_sheets/ppt01_mems_sensor_base_plan_contact_sheet.jpg`
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- `../../assets/contact_sheets/ppt02_apple_audit_product_intro_contact_sheet.jpg`
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- `../../assets/contact_sheets/ppt03_company_intro_20250412_contact_sheet.jpg`
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- `../../assets/contact_sheets/ppt04_company_intro_tc_20250415_contact_sheet.jpg`
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