BZJZ_Material/金刚石散热项目/项目前期工作_MD

项目前期工作 MD 转换索引

更新时间：2026-06-11

本目录由 Mineru_api_client-V2.py 将 项目前期工作/ 中 18 篇 PDF 转换得到，保留原有三类技术路线结构。每篇论文的转换结果位于同名文件夹内，通常包含 .md、images/、*_layout.pdf、*_origin.pdf、*_model.json、*_content_list*.json 等文件。

转换状态：18 / 18 完成。

01_CVD金刚石薄膜与热扩散片

对应路线：CVD 金刚石薄膜、独立膜、热扩散片、大面积基板。

• 1_Diamond as the heat spreader for the thermal dissipation of GaN-based electronic devices
• 2_Heat-spreading diamond films for GaN-based high-power transistor devices
• 3_State-of-the-art synthesis and post-deposition processing of large area CVD diamond substrates for thermal management
• 4_Fabrication of free-standing diamond membranes
• 5_Multilayer diamond heat spreaders for electronic power devices

可用于 PPT 的证据：

• CVD diamond / diamond films are a recognized route for high-power electronic thermal management.
• Free-standing diamond membranes have been demonstrated from diamond-on-silicon films; converted MD records a 15 mm diameter membrane with about 12 um thickness.
• This category supports the proposal's Route B: thin diamond heat spreader in a constrained thermal stack.

02_金属化金刚石载板与器件封装

对应路线：金属化 CVD 金刚石、激光器 submount、器件封装、可靠性。

• 6_Au-(Ti-W) and Au-Cr metallization of chemically vapor-deposited diamond substrates for multichip module applications
• 7_Advanced metallization schemes for bonding of InP-based laser devices to CVD-diamond heatsinks
• 8_Thermal stability of metallized CVD diamond.
• 9_Increasing the output power of single 808-nm laser diodes using diamond submounts produced by microwave plasma chemical vapour deposition

可用于 PPT 的证据：

• Au/Cr and Au/(Ti-W) metallization systems on CVD diamond have published adhesion and annealing evidence; one converted paper reports adhesion above 9 klbf/in2 for Au/(Ti-W) and 11.8 klbf/in2 for Au/Cr under optimized conditions.
• Metallized CVD diamond stability is a known package-level issue, supporting the pitch deck's claim that interface engineering is essential.
• A laser diode submount paper reports stable 8 W operation for more than 150 h on diamond with 700 W/mK thermal conductivity, and 12 W stable cw operation for 24 h on 1600 W/mK diamond.
• This category supports Route A: chip-on-diamond submount for XR optical engine, laser/LED, sensor and high-power module evaluation.

03_改性粉末与CuDiamond复合热沉

对应路线：Ti/W/Cr 等界面改性、Cu/diamond 复合材料、复合热沉、微通道热沉。

• 10_High thermal conductive copper-diamond composites：state of the art
• 11_Microstructure and thermal conductivity of Cu-diamond composites with Ti-coated diamond particles produced by gas pressure infiltration
• 12_Enhanced thermal conductivity in diamond0copper composites with tungsten coatings on diamond particles prepared by magnetron sputtering method
• 13_Optimized thermal properties in diamond particles reinforced copper-titanium matrix composites produced by gas pressure infiltration
• 14_Effect of coating on the microstructure and thermal cond
• 15_The Influence of the Carbide-Forming Metallic Additives (W, Mo, Cr, Ti) on the Microstructure and Thermal Conductivity of Copper-Diamond Composites
• 16_Scalable monolayer-functionalized nanointerface for thermal conductivity enhancement in copper-diamond composite
• 17_Diamond-Cu composites microchannel heat sink for effective thermal management of SiC power devices
• 18_Fabrication of Titanium and Copper-Coated Diamond-Copper Composites via Selective Laser Melting

可用于 PPT 的证据：

• Cu/diamond composites are a mature research route for combining high thermal conductivity with lower CTE than pure copper.
• Converted SLM paper reports 336 W/mK for 1 vol.% copper-coated diamond/copper composite under optimized parameters.
• Interface modification, coating and carbide-forming additives are recurring evidence themes; this supports the proposal's focus on interfacial thermal resistance, not only bulk thermal conductivity.
• This category supports the PoC's diamond-metal submount / heat spreader comparison and future shaped or microchannel heat sink options.

PPT 调用建议

优先把论文证据用于“可行性”和“机制支撑”，避免把文献数据写成博志金钻产品保证值。建议表达：

• Literature supports the feasibility of CVD diamond heat spreaders, metallized diamond submounts and Cu/diamond composites.
• The proposed PoC will validate system-level thermal resistance and hotspot reduction in a Samsung-defined mobile stack.
• Final metrics should be measured on Bozhi Jinzhuan samples under agreed Samsung test conditions.