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博志金钻项目基本情况_知识库/wiki/Sources/PPT/ppt01_mems_sensor_base_plan.md
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博志金钻项目基本情况_知识库/wiki/Sources/PPT/ppt01_mems_sensor_base_plan.md
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---
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source_type: pptx
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title: MEMS传感器智能制造基地项目计划书
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source_path: ../../../博志金钻项目基本情况/2025_3_5_苏州博志金钻-MEMS传感器智能制造基地-项目计划书.pptx
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date_ingested: 2026-06-11-03-46-32
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slides: 19
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---
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# MEMS传感器智能制造基地项目计划书
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## Summary
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本页为 PPT 来源笔记，保留逐页文本、幻灯片预览图和内嵌图片索引。稳定结论已提升到 `Knowledge/` 页面；需要复用图片时优先检索 `Sources/Images/图片快速索引.md`。
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## Source
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- 原始文件：`../../../博志金钻项目基本情况/2025_3_5_苏州博志金钻-MEMS传感器智能制造基地-项目计划书.pptx`
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- 入库时间：`2026-06-11-03-46-32`
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- 幻灯片数量：19
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## Slide Inventory
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### Slide 001: BZJZ
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- Core score: `9`
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- Preview ID: `SLIDE-ppt01_mems_sensor_base_plan-S001`
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- Preview path: `assets/slides/ppt01_mems_sensor_base_plan/slide-001.jpg`
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- Embedded images:
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- `IMG-ppt01_mems_sensor_base_plan-S001-01`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S001_IMG01.jpeg` (1529x859)
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- `IMG-ppt01_mems_sensor_base_plan-S001-02`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S001_IMG02.png` (1444x1125)
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- `IMG-ppt01_mems_sensor_base_plan-S001-03`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S001_IMG03.png` (184x174)
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- `IMG-ppt01_mems_sensor_base_plan-S001-04`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S001_IMG04.png` (317x309)
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Text:
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BZJZ MEMS 传感器智能制造基地 项目计划书 Suzhou Bozhi Technology Co., Ltd. 时间： 2025.3 Address No.8 Changting Road, Suzhou City, Jiangsu
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Province, China Email BZJZ@bzjztech.com
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### Slide 002: 目录
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- Core score: `6`
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- Preview ID: `SLIDE-ppt01_mems_sensor_base_plan-S002`
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- Preview path: `assets/slides/ppt01_mems_sensor_base_plan/slide-002.jpg`
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- Embedded images:
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- `IMG-ppt01_mems_sensor_base_plan-S002-01`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S002_IMG01.jpeg` (1529x859)
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Text:
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目录 01 市场分析 02 投资规划 03 产品与技术方案 04 营 收 分析
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### Slide 003: 市场分析
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- Core score: `-1`
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- Preview ID: `SLIDE-ppt01_mems_sensor_base_plan-S003`
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- Preview path: `assets/slides/ppt01_mems_sensor_base_plan/slide-003.jpg`
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- Embedded images:
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- `IMG-ppt01_mems_sensor_base_plan-S003-01`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S003_IMG01.jpeg` (1529x859)
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- `IMG-ppt01_mems_sensor_base_plan-S003-02`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S003_IMG02.png` (842x844)
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- `IMG-ppt01_mems_sensor_base_plan-S003-03`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S003_IMG03.png` (317x309)
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Text:
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市场分析 01
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### Slide 004: 全球传感器市场格局
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- Core score: `10`
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- Preview ID: `SLIDE-ppt01_mems_sensor_base_plan-S004`
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- Preview path: `assets/slides/ppt01_mems_sensor_base_plan/slide-004.jpg`
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- Embedded images:
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- `IMG-ppt01_mems_sensor_base_plan-S004-01`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S004_IMG01.jpeg` (1346x900)
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Text:
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全球传感器市场格局 2025年MEMS市场规模预测（$150亿+） 根据市场调研机构预测，2025年全球MEMS市场规模将突破150亿美元，年复合增长率保持在8%以上。
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随着5G、物联网、人工智能等新兴技术的发展，MEMS传感器在各领域的应用不断拓展，市场需求持续增长。 消费电子领域，智能手机、平板电脑、可穿戴设备等对MEMS传感器的需求不断增加，预计未来几年年复合增长率达8%。
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汽车电子领域，自动驾驶、智能座舱等技术的发展，推动MEMS传感器在汽车中的应用，年复合增长率有望达到12%。 消费电子/汽车电子双轮驱动（CAGR 8-12%）
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### Slide 005: 细分市场机会
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- Core score: `8`
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- Preview ID: `SLIDE-ppt01_mems_sensor_base_plan-S005`
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- Preview path: `assets/slides/ppt01_mems_sensor_base_plan/slide-005.jpg`
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Text:
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细分市场机会 惯性传感器：智能手机/无人机/ARVR需求 智能手机中，惯性传感器用于运动追踪、姿态检测，随着5G手机的普及，需求持续增长。 无人机领域，惯性传感器是飞行控制的关键部件，市场规模随无人机行业的发展而扩大。
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AR/VR设备中，惯性传感器提供精准的头部和手部追踪，提升沉浸式体验，市场潜力巨大。 压力传感器：新能源车电池管理/白色家电 新能源汽车中，压力传感器用于电池管理系统，监测电池压力，保障电池安全，市场需求旺盛。
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白色家电领域，压力传感器应用于空调、冰箱等产品的压力监测和控制，提升产品性能和用户体验。 温湿度传感器：智能家居/工业物联网 智能家居中，温湿度传感器用于环境监测和智能调控，随着智能家居市场的兴起，需求不断增加。
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工业物联网领域，温湿度传感器广泛应用于生产环境监测、仓储管理等，助力工业智能化升级。
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### Slide 006: 产品与技术方案
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- Core score: `1`
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- Preview ID: `SLIDE-ppt01_mems_sensor_base_plan-S006`
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- Preview path: `assets/slides/ppt01_mems_sensor_base_plan/slide-006.jpg`
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- Embedded images:
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- `IMG-ppt01_mems_sensor_base_plan-S006-01`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S006_IMG01.jpeg` (1529x859)
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- `IMG-ppt01_mems_sensor_base_plan-S006-02`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S006_IMG02.png` (842x844)
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- `IMG-ppt01_mems_sensor_base_plan-S006-03`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S006_IMG03.png` (317x309)
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Text:
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产品与技术方案 02
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### Slide 007: 产品矩阵
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- Core score: `8`
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- Preview ID: `SLIDE-ppt01_mems_sensor_base_plan-S007`
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- Preview path: `assets/slides/ppt01_mems_sensor_base_plan/slide-007.jpg`
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Text:
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产品矩阵 01 车规级6轴IMU芯片，满足汽车电子的高可靠性、高精度要求，助力自动驾驶发展。 工业级6轴IMU芯片，应用于工业自动化、机器人等领域，提供精准的运动控制。 惯性传感器：6轴IMU芯片（车规级/工业级） 02
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MEMS压阻式压力传感器，具有高灵敏度、低功耗特点，适用于消费电子和白色家电。 MEMS电容式压力传感器，精度高、稳定性好，主要用于汽车电子和工业领域。 压力传感器：MEMS压阻式/电容式方案 03 CMOS-
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MEMS集成温湿度传感器，实现单芯片集成，体积小、功耗低，广泛应用于智能家居和物联网。 温湿度传感器：CMOS-MEMS集成传感器
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### Slide 008: 技术
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- Core score: `14`
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- Preview ID: `SLIDE-ppt01_mems_sensor_base_plan-S008`
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- Preview path: `assets/slides/ppt01_mems_sensor_base_plan/slide-008.jpg`
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Text:
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技术 路线 MEMS-ASIC协同设计能力 通过MEMS与ASIC协同设计，优化传感器性能，提高集成度，降低功耗和成本。 建立完善的协同设计流程和工具链，缩短产品研发周期， 快速响应市场需求。 8英寸晶圆级封装工艺
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采用8英寸晶圆级封装工艺，提高封装效率，降低封装成本， 提升产品竞争力。 该工艺可实现高密度封装，满足消费电子等对产品小型化的要求。 自动化测试校准系统 引入自动化测试校准系统，提高测试效率和准确性， 确保产品质量一致性。
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通过大数据分析和机器学习算法，优化测试流程，降低测试成本。
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### Slide 009: 应用场景
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- Core score: `4`
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- Preview ID: `SLIDE-ppt01_mems_sensor_base_plan-S009`
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- Preview path: `assets/slides/ppt01_mems_sensor_base_plan/slide-009.jpg`
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Text:
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应用场景 01 汽车电子案例：ADAS 惯性导航模组 为汽车ADAS系统提供惯性导航模组，实现精准定位和导航，保障行车安全。 该模组具有高可靠性和抗干扰能力，满足汽车电子的严苛要求。 02 家电案例：智能空调 环境感知系统
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为智能空调提供温湿度传感器，实现环境感知和智能调控功能，提升用户舒适度。 通过与空调系统的深度融合，优化空调运行效率，降低能耗。 03 消费电子案例：TWS 耳机运动追踪
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为TWS耳机提供惯性传感器，实现运动追踪和手势识别功能，提升用户体验。 通过低功耗设计和高精度测量，延长耳机续航时间，满足市场需求。
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### Slide 010: 投资规划
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- Core score: `1`
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- Preview ID: `SLIDE-ppt01_mems_sensor_base_plan-S010`
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- Preview path: `assets/slides/ppt01_mems_sensor_base_plan/slide-010.jpg`
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- Embedded images:
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- `IMG-ppt01_mems_sensor_base_plan-S010-01`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S010_IMG01.jpeg` (1529x859)
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- `IMG-ppt01_mems_sensor_base_plan-S010-02`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S010_IMG02.png` (842x844)
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- `IMG-ppt01_mems_sensor_base_plan-S010-03`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S010_IMG03.png` (317x309)
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Text:
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投资规划 03
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### Slide 011: 封装工艺路线
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- Core score: `2`
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- Preview ID: `SLIDE-ppt01_mems_sensor_base_plan-S011`
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- Preview path: `assets/slides/ppt01_mems_sensor_base_plan/slide-011.jpg`
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- Embedded images:
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- `IMG-ppt01_mems_sensor_base_plan-S011-01`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S011_IMG01.png` (11x20)
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- `IMG-ppt01_mems_sensor_base_plan-S011-02`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S011_IMG02.png` (35x20)
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- `IMG-ppt01_mems_sensor_base_plan-S011-03`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S011_IMG03.png` (34x19)
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- `IMG-ppt01_mems_sensor_base_plan-S011-04`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S011_IMG04.png` (35x20)
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- `IMG-ppt01_mems_sensor_base_plan-S011-05`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S011_IMG05.png` (34x19)
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- `IMG-ppt01_mems_sensor_base_plan-S011-06`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S011_IMG06.png` (34x20)
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- `IMG-ppt01_mems_sensor_base_plan-S011-07`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S011_IMG07.png` (34x19)
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- `IMG-ppt01_mems_sensor_base_plan-S011-08`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S011_IMG08.png` (11x21)
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- `IMG-ppt01_mems_sensor_base_plan-S011-09`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S011_IMG09.png` (11x20)
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- `IMG-ppt01_mems_sensor_base_plan-S011-10`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S011_IMG10.png` (11x21)
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- `IMG-ppt01_mems_sensor_base_plan-S011-11`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S011_IMG11.png` (11x20)
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- `IMG-ppt01_mems_sensor_base_plan-S011-12`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S011_IMG12.png` (12x20)
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- `IMG-ppt01_mems_sensor_base_plan-S011-13`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S011_IMG13.png` (12x21)
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- `IMG-ppt01_mems_sensor_base_plan-S011-14`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S011_IMG14.png` (12x21)
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- `IMG-ppt01_mems_sensor_base_plan-S011-15`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S011_IMG15.png` (12x20)
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- `IMG-ppt01_mems_sensor_base_plan-S011-16`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S011_IMG16.png` (12x20)
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Text:
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封装工艺路线 Work order Preparation Die Attach Signal Connection Encapsulati on Backend 工作流程 准备 正/倒贴 信号互联 封装 后段 Reflow & Clean
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回流/清洗 SMD Mount 元器件贴装 Solder Printing 锡膏印刷 Bake 烘烤 Plating 电镀 Trim/Form 切筋打弯 FVI 终检 Back Grinding 晶圆研磨 Wafer Mount 贴切割膜
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Laser Grooving 晶圆激光开槽 FVI 终检 Singulation 切单 Ball Mount 植球 ↓ 个 ↓ . Lead Frame flow ● Substrate flow Bump Reflow 凸块回流 Wire
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Bond 焊线 Underfill 底部填充 Marking 打标 Molding 塑封 Wafer Saw 晶圆切割 Marking 打标 Substrate ● Wafer ● SMT . DBG ↓ 个
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### Slide 012: 建成封装测试能力
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- Core score: `4`
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- Preview ID: `SLIDE-ppt01_mems_sensor_base_plan-S012`
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- Preview path: `assets/slides/ppt01_mems_sensor_base_plan/slide-012.jpg`
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- Embedded images:
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- `IMG-ppt01_mems_sensor_base_plan-S012-01`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S012_IMG01.png` (71x70)
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- `IMG-ppt01_mems_sensor_base_plan-S012-02`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S012_IMG02.png` (66x66)
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- `IMG-ppt01_mems_sensor_base_plan-S012-03`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S012_IMG03.png` (64x64)
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- `IMG-ppt01_mems_sensor_base_plan-S012-04`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S012_IMG04.png` (63x63)
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- `IMG-ppt01_mems_sensor_base_plan-S012-05`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S012_IMG05.png` (62x63)
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- `IMG-ppt01_mems_sensor_base_plan-S012-06`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S012_IMG06.png` (63x62)
|
||||
- `IMG-ppt01_mems_sensor_base_plan-S012-07`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S012_IMG07.png` (63x62)
|
||||
- `IMG-ppt01_mems_sensor_base_plan-S012-08`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S012_IMG08.png` (62x62)
|
||||
- `IMG-ppt01_mems_sensor_base_plan-S012-09`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S012_IMG09.png` (58x59)
|
||||
|
||||
Text:
|
||||
|
||||
建成封装测试能力 惯性传感器 重力计 陀螺仪 加速度计 6轴惯性单元 压力传感器 光学传感器 气压计 工业压力计 胎压传感器 激光雷达 TOF传感器 图像传感器 红外传感器 MEMS微镜 磁传感器 角度计 电子罗盘 霍尔器件 车速传感器
|
||||
环境传感器 声学传感器 气压计 湿度传感器 温度传感器 麦克风传感器 MEMS扬声器 生物传感器 指纹传感器 微流传感器 射频传感器 化学传感器 毫米波雷达 气体传感器 ·
|
||||
|
||||
### Slide 013: 封装设备投资
|
||||
|
||||
- Core score: `4`
|
||||
- Preview ID: `SLIDE-ppt01_mems_sensor_base_plan-S013`
|
||||
- Preview path: `assets/slides/ppt01_mems_sensor_base_plan/slide-013.jpg`
|
||||
|
||||
- Embedded images:
|
||||
- `IMG-ppt01_mems_sensor_base_plan-S013-01`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S013_IMG01.jpeg` (291x182)
|
||||
- `IMG-ppt01_mems_sensor_base_plan-S013-02`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S013_IMG02.jpeg` (256x182)
|
||||
- `IMG-ppt01_mems_sensor_base_plan-S013-03`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S013_IMG03.jpeg` (244x182)
|
||||
- `IMG-ppt01_mems_sensor_base_plan-S013-04`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S013_IMG04.jpeg` (238x182)
|
||||
- `IMG-ppt01_mems_sensor_base_plan-S013-05`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S013_IMG05.jpeg` (197x182)
|
||||
- `IMG-ppt01_mems_sensor_base_plan-S013-06`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S013_IMG06.jpeg` (199x169)
|
||||
- `IMG-ppt01_mems_sensor_base_plan-S013-07`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S013_IMG07.jpeg` (182x182)
|
||||
- `IMG-ppt01_mems_sensor_base_plan-S013-08`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S013_IMG08.jpeg` (171x182)
|
||||
- `IMG-ppt01_mems_sensor_base_plan-S013-09`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S013_IMG09.jpeg` (160x169)
|
||||
- `IMG-ppt01_mems_sensor_base_plan-S013-10`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S013_IMG10.png` (108x182)
|
||||
|
||||
Text:
|
||||
|
||||
封装设备投资 TOWA ASM BTU Camtek EO MiE KS Disco 全自动焊线机 Wire Bonding 全自动晶圆表面检验 机AOI---Ca mtek 全自动研磨贴一体机 Back Grindin g
|
||||
全自动激光开槽机 Laser Grooving 全自动晶圆编带机 全自动打标机 Laser Marki ng 全自动塑封机 Molding 全自动固晶机 Die Bonding 全自动切割机 Wafer Saw 回流焊炉 Reflow
|
||||
|
||||
### Slide 014: 测试设备投资
|
||||
|
||||
- Core score: `6`
|
||||
- Preview ID: `SLIDE-ppt01_mems_sensor_base_plan-S014`
|
||||
- Preview path: `assets/slides/ppt01_mems_sensor_base_plan/slide-014.jpg`
|
||||
|
||||
- Embedded images:
|
||||
- `IMG-ppt01_mems_sensor_base_plan-S014-01`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S014_IMG01.png` (1164x196)
|
||||
- `IMG-ppt01_mems_sensor_base_plan-S014-02`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S014_IMG02.png` (1207x157)
|
||||
|
||||
Text:
|
||||
|
||||
测试设备投资 NHS-330M Air pressure CP/DOT800 MEMS NI-PXI/Aiolos-MPP M T9928 Magnetic F246/MT1000 TMR H3580 TPMS H3580 RH CP/
|
||||
STS8200 H3580 Hall H3580 IMU H3560 ACC
|
||||
|
||||
### Slide 015: 标定设备投资
|
||||
|
||||
- Core score: `6`
|
||||
- Preview ID: `SLIDE-ppt01_mems_sensor_base_plan-S015`
|
||||
- Preview path: `assets/slides/ppt01_mems_sensor_base_plan/slide-015.jpg`
|
||||
|
||||
- Embedded images:
|
||||
- `IMG-ppt01_mems_sensor_base_plan-S015-01`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S015_IMG01.png` (314x218)
|
||||
- `IMG-ppt01_mems_sensor_base_plan-S015-02`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S015_IMG02.jpeg` (285x214)
|
||||
- `IMG-ppt01_mems_sensor_base_plan-S015-03`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S015_IMG03.png` (278x214)
|
||||
- `IMG-ppt01_mems_sensor_base_plan-S015-04`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S015_IMG04.jpeg` (248x218)
|
||||
|
||||
Text:
|
||||
|
||||
标定设备投资 霍尔/磁传感器 TPMS 胎压/ BPS 压力传感 IMU 六轴惯性传感 温湿度传感器
|
||||
|
||||
### Slide 016: 投资明细
|
||||
|
||||
- Core score: `12`
|
||||
- Preview ID: `SLIDE-ppt01_mems_sensor_base_plan-S016`
|
||||
- Preview path: `assets/slides/ppt01_mems_sensor_base_plan/slide-016.jpg`
|
||||
|
||||
- Embedded images:
|
||||
- `IMG-ppt01_mems_sensor_base_plan-S016-01`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S016_IMG01.png` (1024x1024)
|
||||
- `IMG-ppt01_mems_sensor_base_plan-S016-02`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S016_IMG02.png` (1024x1024)
|
||||
- `IMG-ppt01_mems_sensor_base_plan-S016-03`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S016_IMG03.png` (1024x1024)
|
||||
- `IMG-ppt01_mems_sensor_base_plan-S016-04`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S016_IMG04.png` (1024x1024)
|
||||
- `IMG-ppt01_mems_sensor_base_plan-S016-05`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S016_IMG05.png` (800x800)
|
||||
|
||||
Text:
|
||||
|
||||
投资明细 首期建设 5000 平生产基地，包括 3000 平洁净区域，预计投入 150 万美元。 厂房建设 管理及生产团队 30 人， 人员投入 200 万美元。 生产 团队 原材料、流动资金、运营费用等，预计 250 万美元。 运营费用
|
||||
包括 MEMS 传感器的封装、测试设备等，预计产线投入 800 万美元。 设备投资
|
||||
|
||||
### Slide 017: 营收预测
|
||||
|
||||
- Core score: `0`
|
||||
- Preview ID: `SLIDE-ppt01_mems_sensor_base_plan-S017`
|
||||
- Preview path: `assets/slides/ppt01_mems_sensor_base_plan/slide-017.jpg`
|
||||
|
||||
- Embedded images:
|
||||
- `IMG-ppt01_mems_sensor_base_plan-S017-01`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S017_IMG01.jpeg` (1529x859)
|
||||
- `IMG-ppt01_mems_sensor_base_plan-S017-02`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S017_IMG02.png` (842x844)
|
||||
- `IMG-ppt01_mems_sensor_base_plan-S017-03`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S017_IMG03.png` (317x309)
|
||||
|
||||
Text:
|
||||
|
||||
营收预测 04
|
||||
|
||||
### Slide 018: 产能规划
|
||||
|
||||
- Core score: `8`
|
||||
- Preview ID: `SLIDE-ppt01_mems_sensor_base_plan-S018`
|
||||
- Preview path: `assets/slides/ppt01_mems_sensor_base_plan/slide-018.jpg`
|
||||
|
||||
|
||||
Text:
|
||||
|
||||
产能规划 02 首期项目投产后，预计月产 500 万颗传感器芯片，满足市场需求，实现规模效应。 首期项目达产后，预计年产值 达到 1200 万美元。 首期产能：月产 500 万颗 传感器芯片 产值： 01
|
||||
|
||||
### Slide 019: BZJZ
|
||||
|
||||
- Core score: `2`
|
||||
- Preview ID: `SLIDE-ppt01_mems_sensor_base_plan-S019`
|
||||
- Preview path: `assets/slides/ppt01_mems_sensor_base_plan/slide-019.jpg`
|
||||
|
||||
- Embedded images:
|
||||
- `IMG-ppt01_mems_sensor_base_plan-S019-01`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S019_IMG01.png` (1444x1125)
|
||||
- `IMG-ppt01_mems_sensor_base_plan-S019-02`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S019_IMG02.png` (184x174)
|
||||
- `IMG-ppt01_mems_sensor_base_plan-S019-03`：`assets/media/ppt01_mems_sensor_base_plan/ppt01_mems_sensor_base_plan_S019_IMG03.png` (317x309)
|
||||
|
||||
Text:
|
||||
|
||||
BZJZ 谢谢大家 ！ Suzhou Bozhi Technology Co.,Ltd . Address 8 Changting Road, Suzhou City, Jiangsu Province, China Email
|
||||
BZJZ@bzjztech.com
|
||||
@@ -0,0 +1,596 @@
|
||||
---
|
||||
source_type: pptx
|
||||
title: 苹果验厂产品介绍
|
||||
source_path: ../../../博志金钻项目基本情况/※2024_2_24-苏州博志金钻-V终-苹果验厂产品介绍.pptx
|
||||
date_ingested: 2026-06-11-03-46-32
|
||||
slides: 23
|
||||
---
|
||||
|
||||
# 苹果验厂产品介绍
|
||||
|
||||
## Summary
|
||||
|
||||
本页为 PPT 来源笔记，保留逐页文本、幻灯片预览图和内嵌图片索引。稳定结论已提升到 `Knowledge/` 页面；需要复用图片时优先检索 `Sources/Images/图片快速索引.md`。
|
||||
|
||||
## Source
|
||||
|
||||
- 原始文件：`../../../博志金钻项目基本情况/※2024_2_24-苏州博志金钻-V终-苹果验厂产品介绍.pptx`
|
||||
- 入库时间：`2026-06-11-03-46-32`
|
||||
- 幻灯片数量：23
|
||||
|
||||
## Slide Inventory
|
||||
|
||||
### Slide 001: BZJZ
|
||||
|
||||
- Core score: `1`
|
||||
- Preview ID: `SLIDE-ppt02_apple_audit_product_intro-S001`
|
||||
- Preview path: `assets/slides/ppt02_apple_audit_product_intro/slide-001.jpg`
|
||||
|
||||
- Embedded images:
|
||||
- `IMG-ppt02_apple_audit_product_intro-S001-01`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S001_IMG01.png` (1444x1125)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S001-02`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S001_IMG02.png` (184x174)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S001-03`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S001_IMG03.png` (317x309)
|
||||
|
||||
Text:
|
||||
|
||||
BZJZ Advancing Precision Synergizing Innovation Warmly welcome to visit Suzhou Bozhi Technology Co., Ltd. Expert in
|
||||
Surface Treatment Excellence Efficiency Evolution Environmental Friendliness Address No.8 Changting Road, Suzhou City,
|
||||
Jiangsu Province, China Email BZJZ@bzjztech.com
|
||||
|
||||
### Slide 002: About Us
|
||||
|
||||
- Core score: `3`
|
||||
- Preview ID: `SLIDE-ppt02_apple_audit_product_intro-S002`
|
||||
- Preview path: `assets/slides/ppt02_apple_audit_product_intro/slide-002.jpg`
|
||||
|
||||
- Embedded images:
|
||||
- `IMG-ppt02_apple_audit_product_intro-S002-01`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S002_IMG01.png` (950x609)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S002-02`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S002_IMG02.png` (1076x700)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S002-03`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S002_IMG03.png` (1073x700)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S002-04`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S002_IMG04.png` (4096x2730)
|
||||
|
||||
Text:
|
||||
|
||||
About Us Pioneering Excellence in Surface Treatment Innovation Leadership Redefining Advanced Materials Five Generations
|
||||
of R&D Legacy Since 1970s Globally Leading Technologies Nationally Recognized High-tech Enterprise Pioneering & Next-Gen
|
||||
Trustworthy Mass Products Driving Mutual Growth End-to-End Control and Robust Capacity Factories over 10,000m 2
|
||||
Scalable, High-Yield Manufacturing Qualified Process Optimization Application Ecosystem Advancing the frontier of high-
|
||||
performance chips Core Products: High Power Chip Thermal Packaging Materials and Devices TEC Substrates | Laser
|
||||
Heatsinks | Optical Communication Substrates | Sensor Substrates Customer-Centric Product and Service Application
|
||||
Scenarios: OptiCom Modules | Laser | Sensor | Data Center | RF System Suzhou Factory Nantong Factory R&D Laboratory
|
||||
Shandong Factory
|
||||
|
||||
### Slide 003: About Us
|
||||
|
||||
- Core score: `6`
|
||||
- Preview ID: `SLIDE-ppt02_apple_audit_product_intro-S003`
|
||||
- Preview path: `assets/slides/ppt02_apple_audit_product_intro/slide-003.jpg`
|
||||
|
||||
- Embedded images:
|
||||
- `IMG-ppt02_apple_audit_product_intro-S003-01`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S003_IMG01.jpeg` (341x262)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S003-02`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S003_IMG02.png` (426x327)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S003-03`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S003_IMG03.png` (427x286)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S003-04`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S003_IMG04.png` (427x287)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S003-05`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S003_IMG05.jpeg` (341x229)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S003-06`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S003_IMG06.jpeg` (341x229)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S003-07`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S003_IMG07.jpeg` (341x261)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S003-08`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S003_IMG08.jpeg` (341x262)
|
||||
|
||||
Text:
|
||||
|
||||
About Us Advanced, Scalable, and Complete Facilities Advanced equipment with globally leading technologies Fully
|
||||
integrated processes ISO 9001-certified manufacturing processes Real-time monitoring and data traceability Magnetron
|
||||
Sputtering Suzhou Magnetron Sputtering Shandong Magnetron Sputtering Shandong Electric Plating Nantong Etching Nantong
|
||||
Chemical Plating Nantong Developing Nantong Exposure Nantong
|
||||
|
||||
### Slide 004: About Us
|
||||
|
||||
- Core score: `6`
|
||||
- Preview ID: `SLIDE-ppt02_apple_audit_product_intro-S004`
|
||||
- Preview path: `assets/slides/ppt02_apple_audit_product_intro/slide-004.jpg`
|
||||
|
||||
- Embedded images:
|
||||
- `IMG-ppt02_apple_audit_product_intro-S004-01`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S004_IMG01.png` (559x561)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S004-02`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S004_IMG02.png` (60x176)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S004-03`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S004_IMG03.png` (667x661)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S004-04`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S004_IMG04.jpeg` (385x216)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S004-05`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S004_IMG05.png` (4000x2641)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S004-06`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S004_IMG06.png` (416x296)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S004-07`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S004_IMG07.png` (426x260)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S004-08`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S004_IMG08.png` (344x261)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S004-09`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S004_IMG09.png` (622x419)
|
||||
|
||||
Text:
|
||||
|
||||
About Us Empowering Global Leaders with 600+ Customized Excellence TEC Substrate Laser Heatsink Optical Substrate
|
||||
Ceramic-copper Substrate Sensor Image | IR | Pressure | Gas OptiCom 400G | 800G | 1.6T Laser Single-tube laser power ＞
|
||||
35W+ Micro TEC OptiCom | Healthcare | Autograde Annual sales revenue/ million
|
||||
|
||||
### Slide 005: About Us
|
||||
|
||||
- Core score: `6`
|
||||
- Preview ID: `SLIDE-ppt02_apple_audit_product_intro-S005`
|
||||
- Preview path: `assets/slides/ppt02_apple_audit_product_intro/slide-005.jpg`
|
||||
|
||||
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|
||||
- `IMG-ppt02_apple_audit_product_intro-S005-01`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S005_IMG01.png` (2105x965)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S005-02`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S005_IMG02.png` (2105x969)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S005-03`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S005_IMG03.png` (1778x815)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S005-04`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S005_IMG04.jpeg` (467x230)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S005-05`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S005_IMG05.jpeg` (307x230)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S005-06`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S005_IMG06.png` (1106x617)
|
||||
|
||||
Text:
|
||||
|
||||
About Us Empowering Global Leaders with 600+ Customized Excellence DPC （ Direct Plated Copper ） Products -Application
|
||||
Scenarios: Laser | Data Center | RF System Substrate Sputtering Ti/Cu Dry film Exposure & developing Etching Ti/Cu Dry
|
||||
film stripping Thick dry film Exposure & developing Electrocoppering Grinding Dry film stripping Electrolytic Ni/Au Dry
|
||||
film Exposure and developing Evaporating AuSn Dry film stripping Dicing Saw Inspection Packing and Delivery (d) Heat
|
||||
sink process (a) SiC Heat sink (b) AlN Heat sink (c) Diamond Heat sink
|
||||
|
||||
### Slide 006: About Us
|
||||
|
||||
- Core score: `4`
|
||||
- Preview ID: `SLIDE-ppt02_apple_audit_product_intro-S006`
|
||||
- Preview path: `assets/slides/ppt02_apple_audit_product_intro/slide-006.jpg`
|
||||
|
||||
- Embedded images:
|
||||
- `IMG-ppt02_apple_audit_product_intro-S006-01`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S006_IMG01.png` (549x451)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S006-02`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S006_IMG02.png` (346x357)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S006-03`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S006_IMG03.jpeg` (327x184)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S006-04`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S006_IMG04.png` (343x184)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S006-05`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S006_IMG05.jpeg` (327x184)
|
||||
|
||||
Text:
|
||||
|
||||
About Us Empowering Global Leaders with 600+ Customized Excellence 方能演亦 Substrate Evaporating Ti/Pt/Au Spin-on PR
|
||||
Coating Exposure and developing Packing and Delivery Inspection PR Stripping Etching Ti/Pt/Au (a) Etching process of TFC
|
||||
products 方能演亦 Substrate Spin-on PR Coating Exposure and developing Evaporating Ti/Pt/Au Packing and Delivery Inspection
|
||||
PR Stripping (b) Lift off process of TFC products TFC （ Thin Film Ceramic Substrate ） Products -Application Scenarios:
|
||||
OptiCom Modules | Sensor
|
||||
|
||||
### Slide 007: About Us
|
||||
|
||||
- Core score: `2`
|
||||
- Preview ID: `SLIDE-ppt02_apple_audit_product_intro-S007`
|
||||
- Preview path: `assets/slides/ppt02_apple_audit_product_intro/slide-007.jpg`
|
||||
|
||||
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|
||||
- `IMG-ppt02_apple_audit_product_intro-S007-01`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S007_IMG01.png` (545x247)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S007-02`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S007_IMG02.png` (806x1116)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S007-03`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S007_IMG03.png` (648x924)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S007-04`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S007_IMG04.png` (1219x912)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S007-05`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S007_IMG05.png` (889x500)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S007-06`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S007_IMG06.png` (3344x2000)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S007-07`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S007_IMG07.png` (2504x1672)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S007-08`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S007_IMG08.png` (7089x4726)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S007-09`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S007_IMG09.png` (800x561)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S007-10`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S007_IMG10.png` (800x562)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S007-11`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S007_IMG11.png` (479x319)
|
||||
|
||||
Text:
|
||||
|
||||
About Us Driving Industry Innovation, Empowering Client Success 方能演亦 Robust R&D Strength Headed by an academician from
|
||||
the Chinese Academy of Sciences. 48 R&D colleagues 16 PHD degrees 100+ invention patents Collaborate with Premium
|
||||
Clients support for upgrading industry chains Advanced materials, products, and processes Collaborate with Top
|
||||
universities and research institutions R&D recognition and certifications
|
||||
|
||||
### Slide 008: About Us
|
||||
|
||||
- Core score: `4`
|
||||
- Preview ID: `SLIDE-ppt02_apple_audit_product_intro-S008`
|
||||
- Preview path: `assets/slides/ppt02_apple_audit_product_intro/slide-008.jpg`
|
||||
|
||||
- Embedded images:
|
||||
- `IMG-ppt02_apple_audit_product_intro-S008-01`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S008_IMG01.png` (1440x1080)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S008-02`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S008_IMG02.png` (1440x1080)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S008-03`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S008_IMG03.jpeg` (422x294)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S008-04`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S008_IMG04.png` (1440x1080)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S008-05`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S008_IMG05.jpeg` (421x345)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S008-06`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S008_IMG06.jpeg` (442x237)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S008-07`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S008_IMG07.jpeg` (422x237)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S008-08`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S008_IMG08.jpeg` (421x237)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S008-09`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S008_IMG09.png` (1440x1080)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S008-10`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S008_IMG10.jpeg` (422x308)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S008-11`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S008_IMG11.jpeg` (422x279)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S008-12`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S008_IMG12.jpeg` (416x312)
|
||||
|
||||
Text:
|
||||
|
||||
About Us Empowering Global Leaders with 600+ Customized Excellence Film Characterization, Analysis and Testing Center
|
||||
(Suzhou), Electrochemical Laboratory (Nantong), Materials and Device Failure Analysis Center (Xi’an) Scratchmeter X-ray
|
||||
thickness gauge Dynamic Mechanical Analyzer (DMA) Two-dimensional imager Atomic absorption spectrophotometer
|
||||
Simultaneous Thermal Analysis (STA) Scanning electron microscope Charge Analysis System (CAS) Differential Scanning
|
||||
Calorimeter ( DSC ) Tensile tester Semiconductor-pumped nanosecond laser Inductively Coupled Plasma Mass Spectrometer
|
||||
(ICP-MS)
|
||||
|
||||
### Slide 009: Process Capabilities
|
||||
|
||||
- Core score: `0`
|
||||
- Preview ID: `SLIDE-ppt02_apple_audit_product_intro-S009`
|
||||
- Preview path: `assets/slides/ppt02_apple_audit_product_intro/slide-009.jpg`
|
||||
|
||||
- Embedded images:
|
||||
- `IMG-ppt02_apple_audit_product_intro-S009-01`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S009_IMG01.jpeg` (421x232)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S009-02`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S009_IMG02.jpeg` (321x232)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S009-03`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S009_IMG03.jpeg` (321x232)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S009-04`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S009_IMG04.jpeg` (333x241)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S009-05`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S009_IMG05.jpeg` (333x241)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S009-06`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S009_IMG06.png` (1015x751)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S009-07`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S009_IMG07.png` (885x319)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S009-08`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S009_IMG08.png` (283x254)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S009-09`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S009_IMG09.png` (283x254)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S009-10`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S009_IMG10.png` (895x674)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S009-11`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S009_IMG11.jpeg` (379x255)
|
||||
|
||||
Text:
|
||||
|
||||
Process Capabilities Dimensional control Ceramic substrate roughness Ra0.02-0.6μm, thickness tolerance ±0.005mm Minimum
|
||||
line width/spacing of pattern （ 5/5μm ） Uniformity of thickness less than ±5% for think metal films; uniformity of
|
||||
thickness less than ±10% for thick metal films Film structure Magnetron sputtering:Ti , TiW , Ni, Cr, Cu, Ta, etc. and
|
||||
corresponding metal compounds Electro/chemical plating: Cu, Ni, Pd, Au, AuSn , etc. Vacuum evaporation: Ti, Pt, Au, Ni.
|
||||
AuSn , etc. Performance Indications Thick copper tension values: ≥2kgf/mm² Gold tin melt holding time: Over 30s Gold-tin
|
||||
ratio: Thermal shock test: 500 ℃ baking 5min, no damage shedding or blistering Phosphorus content: 6~8% Resistive film:
|
||||
50 ohm±10% Metal film resistor: Less than 50 mohm 75±3wt% of gold in the gold-tin-solder layer of the vapor deposition
|
||||
75±5wt% of gold in the electroplated gold-tin solder layer (a) Polishing disc cross-section micro-morphology (b) Surface
|
||||
micro-morphology of polished discs (c) Patterned film (d) Sputtered Ti/Cu (e) Electroplating Cu/Ni/Au (f) Chemical
|
||||
plating Ni/Pd/Au (g) Thick copper tension values (h) Gold-tin solder melting (i) Gold-to-tin solder layer ratio
|
||||
|
||||
### Slide 010: BY YUSHEN
|
||||
|
||||
- Core score: `2`
|
||||
- Preview ID: `SLIDE-ppt02_apple_audit_product_intro-S010`
|
||||
- Preview path: `assets/slides/ppt02_apple_audit_product_intro/slide-010.jpg`
|
||||
|
||||
- Embedded images:
|
||||
- `IMG-ppt02_apple_audit_product_intro-S010-01`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S010_IMG01.jpeg` (839x612)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S010-02`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S010_IMG02.jpeg` (460x336)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S010-03`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S010_IMG03.jpeg` (839x612)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S010-04`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S010_IMG04.jpeg` (475x347)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S010-05`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S010_IMG05.jpeg` (827x599)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S010-06`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S010_IMG06.jpeg` (468x339)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S010-07`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S010_IMG07.jpeg` (829x588)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S010-08`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S010_IMG08.jpeg` (344x488)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S010-09`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S010_IMG09.tiff` (820x595)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S010-10`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S010_IMG10.jpeg` (355x515)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S010-11`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S010_IMG11.png` (182x168)
|
||||
|
||||
Text:
|
||||
|
||||
BY YUSHEN (c) Morphology of conventional grinding process (d) Dynamic pressure grinding process product surface
|
||||
morphology (e) Dynamic pressure polishing process product surface morphology (b) Simulation results and measured cross-
|
||||
section morphology of dynamic pressure grinding process (a) Conventional grinding process deformation simulation results
|
||||
and measured cross-section morphology High-precision double-sided grinding and polishing technology Evaluate process
|
||||
feasibility using simulation Online monitoring system for core parameters Dynamic pressure balancing system Process
|
||||
Capabilities — High-Efficiency Surface Modification Technology for Ceramic Substrates
|
||||
|
||||
### Slide 011: BY YUSHEN
|
||||
|
||||
- Core score: `4`
|
||||
- Preview ID: `SLIDE-ppt02_apple_audit_product_intro-S011`
|
||||
- Preview path: `assets/slides/ppt02_apple_audit_product_intro/slide-011.jpg`
|
||||
|
||||
- Embedded images:
|
||||
- `IMG-ppt02_apple_audit_product_intro-S011-01`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S011_IMG01.png` (182x168)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S011-02`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S011_IMG02.png` (234x216)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S011-03`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S011_IMG03.png` (1027x727)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S011-04`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S011_IMG04.png` (598x433)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S011-05`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S011_IMG05.tiff` (598x433)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S011-06`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S011_IMG06.tiff` (598x433)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S011-07`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S011_IMG07.png` (1615x1104)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S011-08`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S011_IMG08.png` (617x445)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S011-09`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S011_IMG09.png` (516x385)
|
||||
|
||||
Text:
|
||||
|
||||
BY YUSHEN High-power impulse magnetron sputtering, HiPIMS It is a magnetron sputtering technique that uses a high peak
|
||||
pulse power and a low pulse duty cycle to produce a high sputtered metal dissociation rate. High ionisation rate Low
|
||||
temperature deposition Dense coating High binding strength Process Capabilities — High-Efficiency Sputtering Surface
|
||||
Modification Tec HiPIMS technology DCMS technology (c) Comparison of surface microscopic morphology of film layers
|
||||
deposited by DCMS and HiPIMS techniques HiPIMS technology DCMS technology (d) Comparison of microscopic morphology of
|
||||
cross sections of film layers deposited by DCMS and HiPIMS techniques (a) HiPIMS Power Glow Discharge Coupled Magnetic
|
||||
Field Analogue Simulation (b) Comparison of HiPIMS and DCMS current densities
|
||||
|
||||
### Slide 012: BY YUSHEN
|
||||
|
||||
- Core score: `2`
|
||||
- Preview ID: `SLIDE-ppt02_apple_audit_product_intro-S012`
|
||||
- Preview path: `assets/slides/ppt02_apple_audit_product_intro/slide-012.jpg`
|
||||
|
||||
- Embedded images:
|
||||
- `IMG-ppt02_apple_audit_product_intro-S012-01`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S012_IMG01.jpeg` (770x433)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S012-02`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S012_IMG02.jpeg` (770x433)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S012-03`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S012_IMG03.png` (233x155)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S012-04`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S012_IMG04.jpeg` (598x433)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S012-05`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S012_IMG05.png` (233x155)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S012-06`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S012_IMG06.jpeg` (598x433)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S012-07`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S012_IMG07.png` (233x155)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S012-08`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S012_IMG08.jpeg` (598x433)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S012-09`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S012_IMG09.png` (233x155)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S012-10`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S012_IMG10.jpeg` (598x433)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S012-11`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S012_IMG11.png` (260x173)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S012-12`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S012_IMG12.jpeg` (598x433)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S012-13`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S012_IMG13.png` (260x173)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S012-14`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S012_IMG14.jpeg` (598x433)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S012-15`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S012_IMG15.png` (182x168)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S012-16`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S012_IMG16.png` (234x216)
|
||||
|
||||
Text:
|
||||
|
||||
BY YUSHEN Deep Hole Filling Copper No Hole Technology (b) Electroplated Hole Filling b (a) Copper plating in holes by
|
||||
magnetron sputtering a Thickness of substrate H:0.5mm Through-hole aperture D:0.1mm Pore size ratio H / D =5 : 1 c
|
||||
Thickness of substrate H: 0.5mm Through-hole aperture D: 0.07mm Pore size ratio H / D =7 : 1 d Thickness of substrate
|
||||
H:0.5mm Through-hole aperture D:0.05mm Pore size ratio H / D =10:1 e Thickness of substrate H:0.5mm Through-hole
|
||||
aperture D:0.1mm Pore size ratio H / D =5 : 1 f Thickness of substrate H:0.5mm Through-hole aperture D:0.07mm Pore size
|
||||
ratio H / D =7 : 1 g Thickness of substrate H:0.5mm Through-hole aperture D:0.05mm Pore size ratio H / D =10:1 h No hole
|
||||
filling below 10 : 1 pore size ratio Process Capabilities — High-Efficiency deep hole plating with Copper Filling Tec
|
||||
|
||||
### Slide 013: BY YUSHEN
|
||||
|
||||
- Core score: `4`
|
||||
- Preview ID: `SLIDE-ppt02_apple_audit_product_intro-S013`
|
||||
- Preview path: `assets/slides/ppt02_apple_audit_product_intro/slide-013.jpg`
|
||||
|
||||
- Embedded images:
|
||||
- `IMG-ppt02_apple_audit_product_intro-S013-01`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S013_IMG01.png` (182x168)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S013-02`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S013_IMG02.png` (234x216)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S013-03`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S013_IMG03.png` (303x227)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S013-04`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S013_IMG04.png` (303x228)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S013-05`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S013_IMG05.png` (302x228)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S013-06`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S013_IMG06.png` (303x228)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S013-07`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S013_IMG07.png` (303x228)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S013-08`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S013_IMG08.png` (304x228)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S013-09`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S013_IMG09.png` (996x509)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S013-10`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S013_IMG10.jpeg` (499x326)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S013-11`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S013_IMG11.png` (486x343)
|
||||
|
||||
Text:
|
||||
|
||||
BY YUSHEN Techniques for regulating the organisation of nickel layers and coating stresses Thick gold-plating process
|
||||
capability ➡ 0.8um Thick gold deposition technology 5u”/min 7u”/min 9u”/min (c) Nickel plating speed comparison grain
|
||||
morphology (a) Surface morphology of nickel plating & nickel plating time Ni/P grain increase with nickel plating time
|
||||
(b) Highly Thick Gold Plated Cross Section Process Capabilities — High-efficiency Chemical D eposition Tec
|
||||
|
||||
### Slide 014: Process Flow
|
||||
|
||||
- Core score: `0`
|
||||
- Preview ID: `SLIDE-ppt02_apple_audit_product_intro-S014`
|
||||
- Preview path: `assets/slides/ppt02_apple_audit_product_intro/slide-014.jpg`
|
||||
|
||||
- Embedded images:
|
||||
- `IMG-ppt02_apple_audit_product_intro-S014-01`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S014_IMG01.png` (3648x2736)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S014-02`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S014_IMG02.png` (532x527)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S014-03`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S014_IMG03.png` (1920x1080)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S014-04`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S014_IMG04.png` (904x678)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S014-05`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S014_IMG05.png` (222x154)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S014-06`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S014_IMG06.png` (1702x1276)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S014-07`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S014_IMG07.png` (524x523)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S014-08`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S014_IMG08.png` (596x596)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S014-09`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S014_IMG09.png` (684x683)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S014-10`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S014_IMG10.jpeg` (205x166)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S014-11`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S014_IMG11.png` (205x163)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S014-12`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S014_IMG12.png` (297x399)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S014-13`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S014_IMG13.jpeg` (256x187)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S014-14`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S014_IMG14.png` (297x568)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S014-15`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S014_IMG15.png` (704x702)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S014-16`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S014_IMG16.jpeg` (283x212)
|
||||
|
||||
Text:
|
||||
|
||||
Process Flow 方能演亦 Station 1: Raw materials Huaqing Station2: Grinding Bozhi-suzhou Station 3: Post-grinding cleaning
|
||||
Bozhi-suzhou Station 4: Pre-PVD cleaning Bozhi-suzhou Station 5: Magnetron Sputtering( Ti/Cu) Bozhi-suzhou Station 6:
|
||||
Pre-Dry film cleaning Bozhi-nantong Station7: Dry Film Lamination Bozhi-nantong Station 8: Mask exposure （ Glass pane ）
|
||||
Bozhi-nantong Station 9: Pattern forming Bozhi-nantong Station 10: Plating(Ni/Pd/Au) Bozhi-nantong Electroplate IG EG
|
||||
|
||||
### Slide 015: Process Flow
|
||||
|
||||
- Core score: `0`
|
||||
- Preview ID: `SLIDE-ppt02_apple_audit_product_intro-S015`
|
||||
- Preview path: `assets/slides/ppt02_apple_audit_product_intro/slide-015.jpg`
|
||||
|
||||
- Embedded images:
|
||||
- `IMG-ppt02_apple_audit_product_intro-S015-01`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S015_IMG01.png` (242x540)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S015-02`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S015_IMG02.png` (694x697)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S015-03`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S015_IMG03.png` (902x717)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S015-04`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S015_IMG04.png` (523x682)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S015-05`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S015_IMG05.png` (445x552)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S015-06`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S015_IMG06.png` (520x517)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S015-07`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S015_IMG07.png` (622x618)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S015-08`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S015_IMG08.jpeg` (218x291)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S015-09`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S015_IMG09.jpeg` (259x291)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S015-10`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S015_IMG10.png` (621x541)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S015-11`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S015_IMG11.png` (555x504)
|
||||
|
||||
Text:
|
||||
|
||||
Process Flow 方能演亦 Station 11: Dicing- Cutting Amphenol Station 12: Centrifugal cleaning Amphenol Station 14: Wafer to
|
||||
wafer Amphenol Station 15: Centrifugal cleaning Amphenol Station 16: OQC Amphenol Station 17: Product into PE box
|
||||
Amphenol Station 18: Vacuum and Outer box packaging Amphenol Station 13: Inspection Amphenol
|
||||
|
||||
### Slide 016: Problem description
|
||||
|
||||
- Core score: `0`
|
||||
- Preview ID: `SLIDE-ppt02_apple_audit_product_intro-S016`
|
||||
- Preview path: `assets/slides/ppt02_apple_audit_product_intro/slide-016.jpg`
|
||||
|
||||
- Embedded images:
|
||||
- `IMG-ppt02_apple_audit_product_intro-S016-01`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S016_IMG01.png` (5000x2812)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S016-02`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S016_IMG02.png` (525x357)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S016-03`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S016_IMG03.png` (1535x1087)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S016-04`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S016_IMG04.jpeg` (339x201)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S016-05`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S016_IMG05.png` (694x461)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S016-06`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S016_IMG06.png` (391x329)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S016-07`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S016_IMG07.png` (1192x539)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S016-08`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S016_IMG08.png` (182x168)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S016-09`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S016_IMG09.png` (234x216)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S016-10`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S016_IMG10.png` (1015x716)
|
||||
|
||||
Text:
|
||||
|
||||
Problem description Customer feedback product has holes as shown in Figure 1, our company left the sample of the product
|
||||
for cutting test as shown in Figure 2. Big void in NiP at pad edge. Ni-Cu diffusion/migration observed under Cu. EDX
|
||||
shows sign of oxidised Cu/Ni along void/gap. Indicating poor ENEPlG plating control/process. Krios Project — Hollow &
|
||||
Gap Problems Our company carried out slice analyses on the retained samples, as shown in Figures 2 and 3 1 ： Sample with
|
||||
voids in the Ni layer at the edge of the graph. 2 ： Sample 1pcs, found the customer's feedback on the edge of the
|
||||
graphic, there is a gap between the substrate and the coating, and there is oxidation and Ni layer diffusion in the gap.
|
||||
Fig. 1 Customer FIB analysis test Fig. 3 Our retained sample FIB analysis test Fig. 2 Our retained sample FIB analysis
|
||||
test
|
||||
|
||||
### Slide 017: Analysis of the causes of nickel layer voids
|
||||
|
||||
- Core score: `0`
|
||||
- Preview ID: `SLIDE-ppt02_apple_audit_product_intro-S017`
|
||||
- Preview path: `assets/slides/ppt02_apple_audit_product_intro/slide-017.jpg`
|
||||
|
||||
- Embedded images:
|
||||
- `IMG-ppt02_apple_audit_product_intro-S017-01`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S017_IMG01.png` (5000x2812)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S017-02`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S017_IMG02.png` (1192x539)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S017-03`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S017_IMG03.png` (575x315)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S017-04`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S017_IMG04.png` (182x168)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S017-05`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S017_IMG05.png` (234x216)
|
||||
|
||||
Text:
|
||||
|
||||
Analysis of the causes of nickel layer voids From the cavity morphology, the complete presence of Pd and Au on the
|
||||
outside of the cavity indicates that the cavity here must have been created during the nickel plating process. Possible
|
||||
causes of voids in the nickel plating process 1 ： Abnormal plating solution composition 2 ： Abnormal process parameter
|
||||
overruns 3 ： Contamination by impurities 4 ： Gas stagnation After checking the day's production records, records of
|
||||
chemical water tests, are not abnormal, and process parameters are within the normal range; and nickel-plating time of
|
||||
up to 25min, and the hole is very large, there is no possibility of the existence of the gas retention time here up to
|
||||
25min. Combined with the cavity size of 5~6um, after checking this batch of our use of filter cartridges for 10um,
|
||||
measured may be related to this reason. Figure voids manifestation pattern Krios Project — Hollow & Gap Problems
|
||||
|
||||
### Slide 018: Analysis of the causes of crevice nickel diffusion and oxidation
|
||||
|
||||
- Core score: `2`
|
||||
- Preview ID: `SLIDE-ppt02_apple_audit_product_intro-S018`
|
||||
- Preview path: `assets/slides/ppt02_apple_audit_product_intro/slide-018.jpg`
|
||||
|
||||
- Embedded images:
|
||||
- `IMG-ppt02_apple_audit_product_intro-S018-01`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S018_IMG01.png` (5000x2812)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S018-02`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S018_IMG02.png` (1535x1087)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S018-03`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S018_IMG03.jpeg` (377x223)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S018-04`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S018_IMG04.jpeg` (377x223)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S018-05`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S018_IMG05.jpeg` (377x223)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S018-06`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S018_IMG06.png` (694x461)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S018-07`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S018_IMG07.png` (695x460)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S018-08`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S018_IMG08.png` (692x456)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S018-09`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S018_IMG09.png` (504x296)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S018-10`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S018_IMG10.png` (182x168)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S018-11`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S018_IMG11.png` (234x216)
|
||||
|
||||
Text:
|
||||
|
||||
Analysis of the causes of crevice nickel diffusion and oxidation Our company carried out a slice analysis on the
|
||||
retained samples, and found the nickel diffusion and film oxidation problems feedback from the customer at the edge of
|
||||
the graph, while the centre area of the graph was normal; Graphics in the etching process, because of the isotropy of
|
||||
the etching solution will produce side corrosion, which causes the gap between the aluminium nitride substrate and the
|
||||
plating, the gap is generated before chemical plating, contact with air will cause local oxidation; plating nickel
|
||||
plating process of potion into the gap will react with copper; In combination, this is due to the creation of side-
|
||||
etched gaps during the etching process, which in turn causes localised oxidation, as well as the infiltration of potion
|
||||
during the nickel plating process to produce the nickel layer; Chemical etching For wet processing, there must be
|
||||
lateral etching, so this defect is unavoidable For this we did different process scenarios and Disassembled analysis
|
||||
Krios Project — Hollow & Gap Problems
|
||||
|
||||
### Slide 019: Improvement program
|
||||
|
||||
- Core score: `0`
|
||||
- Preview ID: `SLIDE-ppt02_apple_audit_product_intro-S019`
|
||||
- Preview path: `assets/slides/ppt02_apple_audit_product_intro/slide-019.jpg`
|
||||
|
||||
- Embedded images:
|
||||
- `IMG-ppt02_apple_audit_product_intro-S019-01`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S019_IMG01.png` (5000x2812)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S019-02`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S019_IMG02.jpeg` (609x433)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S019-03`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S019_IMG03.jpeg` (609x433)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S019-04`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S019_IMG04.jpeg` (607x434)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S019-05`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S019_IMG05.jpeg` (608x433)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S019-06`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S019_IMG06.tiff` (599x428)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S019-07`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S019_IMG07.png` (182x168)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S019-08`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S019_IMG08.png` (234x216)
|
||||
|
||||
Text:
|
||||
|
||||
Improvement program Replacement of the filter cartridge in the nickel plating tank from 10um to 5um C6.0 Sampling 5pcs
|
||||
products for FIB test before shipment Sampling results 1 ： No large voids were found in the nickel layer 2 ： Gaps
|
||||
between the substrate and the plating are still present and there is plating oxidation and nickel diffusion Sample 1
|
||||
Sample 2 Sample 3 Sample 4 Sample 5 Shipments: Sampling 5pcs of products for FIB testing, no large voids in the nickel
|
||||
layer were found, normal shipments for C6.0 verification Krios Project — Hollow & Gap Problems
|
||||
|
||||
### Slide 020: 1. Comparison of silver paste shear force of various process solutions
|
||||
|
||||
- Core score: `2`
|
||||
- Preview ID: `SLIDE-ppt02_apple_audit_product_intro-S020`
|
||||
- Preview path: `assets/slides/ppt02_apple_audit_product_intro/slide-020.jpg`
|
||||
|
||||
- Embedded images:
|
||||
- `IMG-ppt02_apple_audit_product_intro-S020-01`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S020_IMG01.png` (5000x2812)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S020-02`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S020_IMG02.png` (182x168)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S020-03`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S020_IMG03.png` (917x952)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S020-04`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S020_IMG04.png` (454x1029)
|
||||
|
||||
Text:
|
||||
|
||||
1. Comparison of silver paste shear force of various process solutions 2. Plating Ni/Pd/Au test average force of 8.374N,
|
||||
the best results 3. The silver paste bonding effect of electroplating Ni/Pd/Au is better than that of EG/IG Different
|
||||
sets of samples were prepared for shear testing using the Electroless plating process and the electroplating process,
|
||||
respectively. Analysis of the causes of low MI shear and the direction of improvement
|
||||
|
||||
### Slide 021: Roughness increased from 0.15um to 0.39um with insignificant increase in shear f
|
||||
|
||||
- Core score: `0`
|
||||
- Preview ID: `SLIDE-ppt02_apple_audit_product_intro-S021`
|
||||
- Preview path: `assets/slides/ppt02_apple_audit_product_intro/slide-021.jpg`
|
||||
|
||||
- Embedded images:
|
||||
- `IMG-ppt02_apple_audit_product_intro-S021-01`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S021_IMG01.png` (5000x2812)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S021-02`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S021_IMG02.png` (182x168)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S021-03`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S021_IMG03.png` (1751x941)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S021-04`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S021_IMG04.png` (1751x941)
|
||||
|
||||
Text:
|
||||
|
||||
Roughness increased from 0.15um to 0.39um with insignificant increase in shear force Increased surface roughness test
|
||||
shear for Electroless plating (EG) programmesElectroless Analysis of the causes of low MI shear and the direction of
|
||||
improvement
|
||||
|
||||
### Slide 022: MI low shear force —
|
||||
|
||||
- Core score: `0`
|
||||
- Preview ID: `SLIDE-ppt02_apple_audit_product_intro-S022`
|
||||
- Preview path: `assets/slides/ppt02_apple_audit_product_intro/slide-022.jpg`
|
||||
|
||||
- Embedded images:
|
||||
- `IMG-ppt02_apple_audit_product_intro-S022-01`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S022_IMG01.png` (5000x2812)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S022-02`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S022_IMG02.png` (182x168)
|
||||
|
||||
Text:
|
||||
|
||||
MI low shear force — Improvement direction Experimental scheme Based on the significant change in the failure mode of EG
|
||||
plated products due to the increase in surface roughness, the following experimental plan was conducted 1. Experimental
|
||||
plan for increasing the roughness of the substrate to increase the roughness of the gold surface of the product
|
||||
Experimental scheme Test result Experimental 1 The grinding process uses 800 # sand to reduce the surface by 10um; Other
|
||||
processes are consistent with C6.0. A u Sa0.391 、 share force ： 2.701N Experimental 2 The grinding process uses 600 #
|
||||
sand to reduce the surface by 10um; Other processes are consistent with C6.0. Au Sa0.546; Share force ： To be verified
|
||||
Experimental 3 The grinding process uses 400 # sand to reduce the surface by 10um; Other processes are consistent with
|
||||
C6.0. Au Sa0.672; Share force ： To be verified 2. Validation plan for products with different process schemes and
|
||||
maximum roughness Experimental scheme Test result Experimental 4 IG+Gold surface roughness 0.54 scheme To be verified
|
||||
Experimental 5 (IG+EG)+Gold surface roughness 0.54 scheme Experimental 6 electroplating +Gold surface roughness 0.54
|
||||
scheme Based on various analytical methods and experimental plans, we are confident in improving the shear force of our
|
||||
products and meeting customer needs.
|
||||
|
||||
### Slide 023: BZJZ
|
||||
|
||||
- Core score: `2`
|
||||
- Preview ID: `SLIDE-ppt02_apple_audit_product_intro-S023`
|
||||
- Preview path: `assets/slides/ppt02_apple_audit_product_intro/slide-023.jpg`
|
||||
|
||||
- Embedded images:
|
||||
- `IMG-ppt02_apple_audit_product_intro-S023-01`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S023_IMG01.png` (1444x1125)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S023-02`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S023_IMG02.png` (184x174)
|
||||
- `IMG-ppt02_apple_audit_product_intro-S023-03`：`assets/media/ppt02_apple_audit_product_intro/ppt02_apple_audit_product_intro_S023_IMG03.png` (317x309)
|
||||
|
||||
Text:
|
||||
|
||||
BZJZ Advancing Precision Synergizing Innovation Warmly welcome to visit Suzhou Bozhi Technology Co.,Ltd . Expert in
|
||||
Surface Treatment Excellence Efficiency Evolution Environmental Friendly ADRESS No.8, Changting Road, Suzhou City,
|
||||
Jiangsu Province, China Email BZJZ@bzjztech.com
|
||||
329
博志金钻项目基本情况_知识库/wiki/Sources/PPT/ppt03_company_intro_20250412.md
Normal file
329
博志金钻项目基本情况_知识库/wiki/Sources/PPT/ppt03_company_intro_20250412.md
Normal file
@@ -0,0 +1,329 @@
|
||||
---
|
||||
source_type: pptx
|
||||
title: 苏州博志金钻科技有限责任公司介绍材料 2025-04-12
|
||||
source_path: ../../../博志金钻项目基本情况/※2025_4_12_苏州博志金钻科技有限责任公司介绍材料 .pptx
|
||||
date_ingested: 2026-06-11-03-46-32
|
||||
slides: 16
|
||||
---
|
||||
|
||||
# 苏州博志金钻科技有限责任公司介绍材料 2025-04-12
|
||||
|
||||
## Summary
|
||||
|
||||
本页为 PPT 来源笔记，保留逐页文本、幻灯片预览图和内嵌图片索引。稳定结论已提升到 `Knowledge/` 页面；需要复用图片时优先检索 `Sources/Images/图片快速索引.md`。
|
||||
|
||||
## Source
|
||||
|
||||
- 原始文件：`../../../博志金钻项目基本情况/※2025_4_12_苏州博志金钻科技有限责任公司介绍材料 .pptx`
|
||||
- 入库时间：`2026-06-11-03-46-32`
|
||||
- 幻灯片数量：16
|
||||
|
||||
## Slide Inventory
|
||||
|
||||
### Slide 001: BZJZ
|
||||
|
||||
- Core score: `11`
|
||||
- Preview ID: `SLIDE-ppt03_company_intro_20250412-S001`
|
||||
- Preview path: `assets/slides/ppt03_company_intro_20250412/slide-001.jpg`
|
||||
|
||||
- Embedded images:
|
||||
- `IMG-ppt03_company_intro_20250412-S001-01`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S001_IMG01.png` (2000x1255)
|
||||
- `IMG-ppt03_company_intro_20250412-S001-02`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S001_IMG02.png` (1000x667)
|
||||
- `IMG-ppt03_company_intro_20250412-S001-03`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S001_IMG03.png` (317x309)
|
||||
|
||||
Text:
|
||||
|
||||
BZJZ 苏州博志金钻科技有限责任公司 地址：苏州高新区长亭路 8 号大新科技园 3 幢 联系方式： 157 1520 1195 高功率芯片散热材料与封装器件 苏州博志金钻科技有限责任公司 Suzhou Bozhijinzuan
|
||||
Technology.Co.,Ltd 先进的膜层成型技术 / 全链条表面处理方案 / 高品质陶瓷载板与器件
|
||||
|
||||
### Slide 002: 创新引领
|
||||
|
||||
- Core score: `25`
|
||||
- Preview ID: `SLIDE-ppt03_company_intro_20250412-S002`
|
||||
- Preview path: `assets/slides/ppt03_company_intro_20250412/slide-002.jpg`
|
||||
|
||||
- Embedded images:
|
||||
- `IMG-ppt03_company_intro_20250412-S002-01`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S002_IMG01.png` (950x609)
|
||||
- `IMG-ppt03_company_intro_20250412-S002-02`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S002_IMG02.png` (1076x700)
|
||||
- `IMG-ppt03_company_intro_20250412-S002-03`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S002_IMG03.png` (1073x700)
|
||||
|
||||
Text:
|
||||
|
||||
创新引领 前沿技术 重新定义先进材料 始于 1970 年代的五代研发传承 全球领先 的技 术 权威认证的高新技术企业 开拓创新，引领下一代技术 研发能力：国家级研发中心、中国科学院院士团队 研发历程： 15 年 批量稳定出货能力
|
||||
驱动共同成长 全流程可控的稳健产能 超过 1W 平方米的制造基地 可扩展的高良率生产线 经过验证的工艺优化体系 员工人数： 90 人 专利数量： 4 0 余项 公司估值： 8 亿 人民币 高端散热封装产品体系 赋能高功率产业前沿
|
||||
核心产品：高功率芯片热管理封装材料与器件 TEC 载板 | 激光散热器 | 光通信载板 | 传感器载板 以客户为中心的产品与服务 应用场景：光通信模块 | 激光器 | 传感器 | 数据中心 | 射频系统 苏州工厂 南通工厂 研发实验室
|
||||
公司简介
|
||||
|
||||
### Slide 003: 芯片结构、发展趋势与重大挑战
|
||||
|
||||
- Core score: `10`
|
||||
- Preview ID: `SLIDE-ppt03_company_intro_20250412-S003`
|
||||
- Preview path: `assets/slides/ppt03_company_intro_20250412/slide-003.jpg`
|
||||
|
||||
- Embedded images:
|
||||
- `IMG-ppt03_company_intro_20250412-S003-01`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S003_IMG01.png` (242x242)
|
||||
|
||||
Text:
|
||||
|
||||
芯片结构、发展趋势与重大挑战 芯片小型化、高性能 随着 各类芯片 尺寸越来 越小 ， 性能越来越强 ， 必然结果是单位面积平均功耗的提高，对散热的要求大幅提升 当前芯片面临两大问题 高散热 高密度互联 典型的芯片散热封装结构 高散热挑战
|
||||
局部热点对可靠性具有致命威胁 现有材料的导热能力和热应力受限、材料老化 动态功耗波动造成焊点疲劳和热疲劳 高密度布线散热路径受限，形成局部热点 换热器 热沉 TEC 载板 Die 高密度互联挑战 导线尺寸缩小导致电阻增加
|
||||
传统散热技术不满足超薄芯片、微型化封装空间 电流密度高引发电迁移，造成材料老化
|
||||
|
||||
### Slide 004: 芯片结构、发展趋势与重大挑战
|
||||
|
||||
- Core score: `12`
|
||||
- Preview ID: `SLIDE-ppt03_company_intro_20250412-S004`
|
||||
- Preview path: `assets/slides/ppt03_company_intro_20250412/slide-004.jpg`
|
||||
|
||||
|
||||
Text:
|
||||
|
||||
芯片结构、发展趋势与重大挑战 功率器件芯片、传感器芯片、光通讯芯片、运算存储芯片 芯片 绝缘材料为基底、通过金属布线满足芯片贴片及电信号传输功能 载板 能够快速进行热传导，将热量从一面传导到另一面 ， 实现制冷 与精准温控 主动散热器件
|
||||
热传导能力强、且吸热温度不会剧烈上升的材料 起到暂存储热量的 作用 热沉 通过结构设计和翅片、配合风冷水冷的方式将热量传送到外部 换热器 典型的芯片散热封装结构 热膨胀系数匹配、高导热 高 密度 电信号传导、轻量化 换热器 热沉 TEC
|
||||
载板 Die
|
||||
|
||||
### Slide 005: 产品管线
|
||||
|
||||
- Core score: `10`
|
||||
- Preview ID: `SLIDE-ppt03_company_intro_20250412-S005`
|
||||
- Preview path: `assets/slides/ppt03_company_intro_20250412/slide-005.jpg`
|
||||
|
||||
- Embedded images:
|
||||
- `IMG-ppt03_company_intro_20250412-S005-01`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S005_IMG01.png` (528x436)
|
||||
- `IMG-ppt03_company_intro_20250412-S005-02`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S005_IMG02.png` (1287x946)
|
||||
- `IMG-ppt03_company_intro_20250412-S005-03`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S005_IMG03.png` (1920x1080)
|
||||
- `IMG-ppt03_company_intro_20250412-S005-04`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S005_IMG04.jpeg` (611x436)
|
||||
|
||||
Text:
|
||||
|
||||
产品管线 芯片封装器件的制备核心是解决不同材料间异质界面的问题 陶瓷具有高热导和优良电气性能，通过高密度高精度金属布线，实现芯片直接贴片，满足芯片的高散热和大电流传输的需求。 基体材料：氮化铝 AlN 、氧化铝 Al 2 O 3
|
||||
、单晶金刚石、聚晶金刚石 金属化方案： Ti/Cu/Ni/Pd/Au 、 Ti/Pt/Au 稳定量产阶段 陶瓷载板 金刚石 – 金属复合材料 金刚石铜 金刚石银 金刚石铝 中试阶段 散热垫片（热的填充物） 铝碳化硅 AlSiC 覆铜垫片
|
||||
陶瓷覆铜垫片 中试阶段 新一代封装方式 TGV 玻璃芯片载板 金属覆陶瓷载板 研发阶段
|
||||
|
||||
### Slide 006: 产品
|
||||
|
||||
- Core score: `16`
|
||||
- Preview ID: `SLIDE-ppt03_company_intro_20250412-S006`
|
||||
- Preview path: `assets/slides/ppt03_company_intro_20250412/slide-006.jpg`
|
||||
|
||||
- Embedded images:
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||||
- `IMG-ppt03_company_intro_20250412-S006-01`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S006_IMG01.png` (559x561)
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||||
- `IMG-ppt03_company_intro_20250412-S006-02`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S006_IMG02.png` (667x661)
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- `IMG-ppt03_company_intro_20250412-S006-03`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S006_IMG03.jpeg` (385x216)
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- `IMG-ppt03_company_intro_20250412-S006-04`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S006_IMG04.png` (4000x2641)
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- `IMG-ppt03_company_intro_20250412-S006-05`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S006_IMG05.png` (416x296)
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- `IMG-ppt03_company_intro_20250412-S006-06`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S006_IMG06.png` (426x260)
|
||||
- `IMG-ppt03_company_intro_20250412-S006-07`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S006_IMG07.png` (344x261)
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- `IMG-ppt03_company_intro_20250412-S006-08`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S006_IMG08.png` (622x419)
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Text:
|
||||
|
||||
产品 陶瓷载板 TEC 载板 激光热沉 光通讯载板 陶瓷覆铜板 传感器 图像传感器 | 红外传感器 压力传感器 | 气体传感器 光通讯模块 400G | 800G | 1.6T 激光器件 单管激光器 功率＞ 35W+ 热电制冷器件 光通信
|
||||
| 医疗健康 | 汽车级应用 Annual sales revenue/ million 3 30 亿元 陶瓷载板 市场规模 月产能：三寸片 50K Panel / 单科颗 5kk-20kk PCS
|
||||
|
||||
### Slide 007: 产品
|
||||
|
||||
- Core score: `6`
|
||||
- Preview ID: `SLIDE-ppt03_company_intro_20250412-S007`
|
||||
- Preview path: `assets/slides/ppt03_company_intro_20250412/slide-007.jpg`
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||||
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- Embedded images:
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||||
- `IMG-ppt03_company_intro_20250412-S007-01`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S007_IMG01.png` (2105x961)
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||||
- `IMG-ppt03_company_intro_20250412-S007-02`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S007_IMG02.png` (2105x965)
|
||||
- `IMG-ppt03_company_intro_20250412-S007-03`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S007_IMG03.png` (2105x965)
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||||
- `IMG-ppt03_company_intro_20250412-S007-04`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S007_IMG04.png` (1778x815)
|
||||
- `IMG-ppt03_company_intro_20250412-S007-05`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S007_IMG05.jpeg` (467x230)
|
||||
- `IMG-ppt03_company_intro_20250412-S007-06`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S007_IMG06.jpeg` (307x230)
|
||||
- `IMG-ppt03_company_intro_20250412-S007-07`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S007_IMG07.png` (1106x617)
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||||
|
||||
Text:
|
||||
|
||||
产品 陶瓷载板 - 应用领域：激光器 | 数据中心 | 射频系统 Substrate Sputtering Ti/Cu Dry Film Exposure & Developing Etching Ti/Cu Dry Film
|
||||
Stripping Thick Dry Film Exposure & Developing Electrocoppering Grinding Dry Film Stripping Electrolytic Ni/Au Dry Film
|
||||
Exposure & Developing Evaporating AuSn Dry Film Stripping Dicing Saw Inspection Packing & Delivery DPC 载板加工流程 单晶金刚石载板
|
||||
氮化铝载板 聚晶金刚石载板 DPC 载板（ Direct Plated Copper ）
|
||||
|
||||
### Slide 008: 方能演亦
|
||||
|
||||
- Core score: `10`
|
||||
- Preview ID: `SLIDE-ppt03_company_intro_20250412-S008`
|
||||
- Preview path: `assets/slides/ppt03_company_intro_20250412/slide-008.jpg`
|
||||
|
||||
- Embedded images:
|
||||
- `IMG-ppt03_company_intro_20250412-S008-01`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S008_IMG01.png` (549x451)
|
||||
- `IMG-ppt03_company_intro_20250412-S008-02`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S008_IMG02.png` (346x357)
|
||||
- `IMG-ppt03_company_intro_20250412-S008-03`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S008_IMG03.jpeg` (327x184)
|
||||
- `IMG-ppt03_company_intro_20250412-S008-04`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S008_IMG04.png` (343x184)
|
||||
- `IMG-ppt03_company_intro_20250412-S008-05`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S008_IMG05.jpeg` (327x184)
|
||||
|
||||
Text:
|
||||
|
||||
方能演亦 Substrate Evaporating Ti/Pt/Au Spin-on PR Coating Exposure & Developing Packing & Delivery Inspection PR Stripping
|
||||
Etching Ti/Pt/Au TFC 载板 —— 蚀刻工艺 方能演亦 Substrate Spin-on PR Coating Exposure & Developing Evaporating Ti/Pt/Au Packing &
|
||||
Delivery Inspection PR Stripping TFC 载板 —— 剥离工艺 产品 陶瓷载板 - 应用领域：光通讯模块 | 传感器 TFC 载板（ Thin Film Ceramic Substrate ）
|
||||
|
||||
### Slide 009: 产品
|
||||
|
||||
- Core score: `12`
|
||||
- Preview ID: `SLIDE-ppt03_company_intro_20250412-S009`
|
||||
- Preview path: `assets/slides/ppt03_company_intro_20250412/slide-009.jpg`
|
||||
|
||||
- Embedded images:
|
||||
- `IMG-ppt03_company_intro_20250412-S009-01`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S009_IMG01.jpeg` (554x554)
|
||||
- `IMG-ppt03_company_intro_20250412-S009-02`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S009_IMG02.png` (1287x946)
|
||||
- `IMG-ppt03_company_intro_20250412-S009-03`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S009_IMG03.png` (733x702)
|
||||
- `IMG-ppt03_company_intro_20250412-S009-04`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S009_IMG04.png` (1920x1080)
|
||||
- `IMG-ppt03_company_intro_20250412-S009-05`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S009_IMG05.jpeg` (438x312)
|
||||
- `IMG-ppt03_company_intro_20250412-S009-06`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S009_IMG06.png` (425x396)
|
||||
|
||||
Text:
|
||||
|
||||
产品 金刚石 - 金属复合材料、散热垫片、新一代封装材料 金刚石是自然界中热导率最高的物质，粉末状金刚石已经实现低成本量产 通过金刚石与金属的复合材料，可同时实现高导热和适配的 低 热膨胀系数的优点 金刚石 - 金属复合材料 激光器
|
||||
微波射频模块 金刚石铜 金刚石铝 铝碳化硅覆铜垫片 陶瓷覆金垫片 TGV 芯片载板 金属覆陶瓷载板 在散热模块中会存在空隙，这种空隙是热阻的巨大来源 通过 陶瓷 、 铝 碳化硅 等 高导热、轻量化的 材料 制备成
|
||||
器件进行填充，可优化模块整体散热 散热垫片 IGBT 模块 光学模块 TGV 玻璃芯片载板：通过玻璃上的高密度通孔互联，实现芯片的高密度封装 金属覆陶瓷载板：通过在金属上沉积高耐压的陶瓷薄膜及 RD L 布线，实现载板与金属热沉的一体化方案
|
||||
新一代封装材料 3D 封装 运算存储芯片 120 亿 市场预期 80 亿 市场预期 230 亿 市场预期
|
||||
|
||||
### Slide 010: 生产能力
|
||||
|
||||
- Core score: `2`
|
||||
- Preview ID: `SLIDE-ppt03_company_intro_20250412-S010`
|
||||
- Preview path: `assets/slides/ppt03_company_intro_20250412/slide-010.jpg`
|
||||
|
||||
- Embedded images:
|
||||
- `IMG-ppt03_company_intro_20250412-S010-01`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S010_IMG01.png` (250x251)
|
||||
|
||||
Text:
|
||||
|
||||
生产能力 陶瓷 载板 金刚石 - 金属复合 材料 散热 垫片 新一代 封装材料 机加工 激光加工 PVD 粉末烧结 光刻 电镀 化镀 切割
|
||||
|
||||
### Slide 011: 技术优势
|
||||
|
||||
- Core score: `12`
|
||||
- Preview ID: `SLIDE-ppt03_company_intro_20250412-S011`
|
||||
- Preview path: `assets/slides/ppt03_company_intro_20250412/slide-011.jpg`
|
||||
|
||||
- Embedded images:
|
||||
- `IMG-ppt03_company_intro_20250412-S011-01`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S011_IMG01.jpeg` (3072x2224)
|
||||
- `IMG-ppt03_company_intro_20250412-S011-02`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S011_IMG02.jpeg` (1279x1706)
|
||||
- `IMG-ppt03_company_intro_20250412-S011-03`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S011_IMG03.png` (445x394)
|
||||
- `IMG-ppt03_company_intro_20250412-S011-04`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S011_IMG04.png` (636x633)
|
||||
- `IMG-ppt03_company_intro_20250412-S011-05`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S011_IMG05.png` (685x721)
|
||||
- `IMG-ppt03_company_intro_20250412-S011-06`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S011_IMG06.png` (1633x956)
|
||||
- `IMG-ppt03_company_intro_20250412-S011-07`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S011_IMG07.png` (885x319)
|
||||
|
||||
Text:
|
||||
|
||||
技术优势 陶瓷 - 金属 界面结合 膜系 结构设计 合金相 制备 高精度 图形化 复合金属 薄膜形态控制 界面热阻是最大的 热阻来源，直接影响陶瓷热沉使用可靠性。 自研设备 + 先进工艺，实现金属在陶瓷表面完全成膜。
|
||||
包覆完全、无任何孔洞、结合力高，可满足 450° 热冲击要求。 针对不同类型的大功率芯片，设计满足键合互联、尺寸厚度和高频特性要求的表面图形与金属层方案。
|
||||
根据芯片使用场景，采用定制化膜层设计，实现更优产品性能，打破国外在封装器件结构设计上的垄断。 陶瓷热沉的金属层方案包含金锡合金、镍铬合金和钛钨合金，且各金属层间存在相互扩散现象。
|
||||
博志金钻团队依托国家重点实验室在薄膜合金领域逾十年的经验及自主研发的磁控溅射与蒸镀设备，实现了各类合金相的设计与制备。 陶瓷热沉中高端产品要求高对位精度和精细线宽线距，部分产品还要求金属图形具备优良 R 角、无边缘毛刺和良好轮廓度。
|
||||
选择不同的感光材料和曝光方式，并搭配自主设计定制的显影与蚀刻工艺，满足产品对线宽、对位精度及外观的严格要求。 全套电镀化镀工艺 + 多步显影蚀刻方案，实现各区域金属层不同厚度与包覆要求。 自主研发的电镀药水 +
|
||||
整流器，实现高速高质的填孔与增厚 通过特殊整平工艺满足金属层 R 角与表面粗糙度要求。
|
||||
|
||||
### Slide 012: 设备
|
||||
|
||||
- Core score: `10`
|
||||
- Preview ID: `SLIDE-ppt03_company_intro_20250412-S012`
|
||||
- Preview path: `assets/slides/ppt03_company_intro_20250412/slide-012.jpg`
|
||||
|
||||
- Embedded images:
|
||||
- `IMG-ppt03_company_intro_20250412-S012-01`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S012_IMG01.jpeg` (341x262)
|
||||
- `IMG-ppt03_company_intro_20250412-S012-02`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S012_IMG02.png` (426x327)
|
||||
- `IMG-ppt03_company_intro_20250412-S012-03`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S012_IMG03.png` (427x286)
|
||||
- `IMG-ppt03_company_intro_20250412-S012-04`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S012_IMG04.png` (427x287)
|
||||
- `IMG-ppt03_company_intro_20250412-S012-05`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S012_IMG05.jpeg` (341x229)
|
||||
- `IMG-ppt03_company_intro_20250412-S012-06`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S012_IMG06.jpeg` (341x229)
|
||||
- `IMG-ppt03_company_intro_20250412-S012-07`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S012_IMG07.jpeg` (341x261)
|
||||
- `IMG-ppt03_company_intro_20250412-S012-08`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S012_IMG08.jpeg` (341x262)
|
||||
|
||||
Text:
|
||||
|
||||
设备 生产设备 核心设备自主设计定制，拥有独立知识产权 率先拉通陶瓷载板全道生产工艺，全部生产环节自主可控 通过 ISO 三体系认证，一万平米生产车间落实 5S 管理 通过多个行业龙头客户审核，获得 20 余家龙头企业供应商资质
|
||||
|
||||
### Slide 013: 设备
|
||||
|
||||
- Core score: `2`
|
||||
- Preview ID: `SLIDE-ppt03_company_intro_20250412-S013`
|
||||
- Preview path: `assets/slides/ppt03_company_intro_20250412/slide-013.jpg`
|
||||
|
||||
- Embedded images:
|
||||
- `IMG-ppt03_company_intro_20250412-S013-01`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S013_IMG01.png` (1440x1080)
|
||||
- `IMG-ppt03_company_intro_20250412-S013-02`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S013_IMG02.png` (1440x1080)
|
||||
- `IMG-ppt03_company_intro_20250412-S013-03`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S013_IMG03.jpeg` (422x294)
|
||||
- `IMG-ppt03_company_intro_20250412-S013-04`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S013_IMG04.png` (1440x1080)
|
||||
- `IMG-ppt03_company_intro_20250412-S013-05`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S013_IMG05.jpeg` (421x345)
|
||||
- `IMG-ppt03_company_intro_20250412-S013-06`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S013_IMG06.jpeg` (442x237)
|
||||
- `IMG-ppt03_company_intro_20250412-S013-07`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S013_IMG07.jpeg` (422x237)
|
||||
- `IMG-ppt03_company_intro_20250412-S013-08`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S013_IMG08.jpeg` (421x237)
|
||||
- `IMG-ppt03_company_intro_20250412-S013-09`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S013_IMG09.png` (1440x1080)
|
||||
- `IMG-ppt03_company_intro_20250412-S013-10`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S013_IMG10.jpeg` (422x308)
|
||||
- `IMG-ppt03_company_intro_20250412-S013-11`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S013_IMG11.jpeg` (422x279)
|
||||
- `IMG-ppt03_company_intro_20250412-S013-12`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S013_IMG12.jpeg` (416x312)
|
||||
|
||||
Text:
|
||||
|
||||
设备 研发检验设备 划痕仪 X-ray 测厚仪 动态力学分析仪 二次元影像仪 原子吸收分光光度计 同步热分析仪 扫描电子显微镜 电荷分析系统 差示扫描量热仪 拉力试验机 半导体泵浦纳秒激光器 电感耦合等离子体质谱仪
|
||||
|
||||
### Slide 014: 团队成员
|
||||
|
||||
- Core score: `16`
|
||||
- Preview ID: `SLIDE-ppt03_company_intro_20250412-S014`
|
||||
- Preview path: `assets/slides/ppt03_company_intro_20250412/slide-014.jpg`
|
||||
|
||||
|
||||
Text:
|
||||
|
||||
团队成员 潘远志 创始人、总经理、董事长 西安交通大学 电气 博士 西安交通大学 人工智能 本科 西交利物浦大学校外导师 技术研发、公司治理、战略规划、业务运营等 苏州市创业领军人才 苏州 市青年五四 奖章 苏州市青科协副秘书长
|
||||
福布斯三十岁以下行业精英榜单 胡润三十五岁以下创业先锋榜单 多学科融合背景，具有丰富的半导体、新材料等行业经验 技术研发 生产制造 运营管理 西安交通大学材料学硕士 曾在华为2012实验室负责陶瓷器件表面处理
|
||||
在陶瓷金属化领域有着十余年研发经验 靳XX | 研发总监 技术顾问委员会 金属材料强度国家重点实验室主任 973项目首席科学家 孙 军 中国科学院院士 万人计划“领军人才 ” 西安交通大学材料表面处理中心主任 宋忠孝 西安交通大学教授
|
||||
韩XX | 工艺 总监 西安交通大学材料学硕士 曾任某大型制造型企业生产副总 在磁控溅射领域有着十余年生产管理经验 虞XX | 生产主管 线路板行业从事生产管理20余年 曾任某大型线路板企业生产部长 具有200-1000人工厂生产管理经验
|
||||
李 XX | 生产主管 电子科技大学毕业 曾就职于入中电科13所工作 主持搭建国内第一条陶瓷载板产线， 集成电路与陶瓷载板领域有 2 0余年经验 邓XX | 副总经理 制造业企业十余年财务管理经验 注册会计师（ CPA ） 张 XX |
|
||||
财务总监 薛 XX | 副总经理 西安交通大学管理与工程博士 胡润 30Under30s 苏州市三八红旗手 西安交通大学化学 + 金融硕士 曾就职华泰证券 曾任某科技领域私募基金任投资总监，基金管理规模超 20 亿元 技术顾问
|
||||
|
||||
### Slide 015: 荣誉与资质
|
||||
|
||||
- Core score: `4`
|
||||
- Preview ID: `SLIDE-ppt03_company_intro_20250412-S015`
|
||||
- Preview path: `assets/slides/ppt03_company_intro_20250412/slide-015.jpg`
|
||||
|
||||
- Embedded images:
|
||||
- `IMG-ppt03_company_intro_20250412-S015-01`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S015_IMG01.png` (545x247)
|
||||
- `IMG-ppt03_company_intro_20250412-S015-02`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S015_IMG02.png` (7089x4726)
|
||||
- `IMG-ppt03_company_intro_20250412-S015-03`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S015_IMG03.png` (800x561)
|
||||
- `IMG-ppt03_company_intro_20250412-S015-04`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S015_IMG04.png` (800x562)
|
||||
- `IMG-ppt03_company_intro_20250412-S015-05`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S015_IMG05.png` (479x319)
|
||||
- `IMG-ppt03_company_intro_20250412-S015-06`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S015_IMG06.png` (653x933)
|
||||
- `IMG-ppt03_company_intro_20250412-S015-07`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S015_IMG07.png` (745x1048)
|
||||
- `IMG-ppt03_company_intro_20250412-S015-08`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S015_IMG08.png` (655x931)
|
||||
- `IMG-ppt03_company_intro_20250412-S015-09`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S015_IMG09.png` (660x928)
|
||||
- `IMG-ppt03_company_intro_20250412-S015-10`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S015_IMG10.png` (593x838)
|
||||
- `IMG-ppt03_company_intro_20250412-S015-11`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S015_IMG11.jpeg` (1654x2339)
|
||||
- `IMG-ppt03_company_intro_20250412-S015-12`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S015_IMG12.jpeg` (1654x2339)
|
||||
- `IMG-ppt03_company_intro_20250412-S015-13`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S015_IMG13.jpeg` (1654x2339)
|
||||
- `IMG-ppt03_company_intro_20250412-S015-14`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S015_IMG14.png` (479x679)
|
||||
- `IMG-ppt03_company_intro_20250412-S015-15`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S015_IMG15.png` (483x683)
|
||||
- `IMG-ppt03_company_intro_20250412-S015-16`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S015_IMG16.png` (800x561)
|
||||
- `IMG-ppt03_company_intro_20250412-S015-17`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S015_IMG17.jpeg` (800x559)
|
||||
- `IMG-ppt03_company_intro_20250412-S015-18`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S015_IMG18.jpeg` (800x560)
|
||||
- `IMG-ppt03_company_intro_20250412-S015-19`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S015_IMG19.jpeg` (800x532)
|
||||
- `IMG-ppt03_company_intro_20250412-S015-20`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S015_IMG20.png` (541x272)
|
||||
|
||||
Text:
|
||||
|
||||
荣誉与资质 方能演亦 研发实力强大 中科院士领衔技术顾问 16 名全职研发人员 40 多项发明专利 独立授权许可 体系合规认证 荣誉资质 环保许可 能碳许可 ISO9001 、 14001 、 45001 RoHS REACH
|
||||
|
||||
### Slide 016: BZJZ
|
||||
|
||||
- Core score: `12`
|
||||
- Preview ID: `SLIDE-ppt03_company_intro_20250412-S016`
|
||||
- Preview path: `assets/slides/ppt03_company_intro_20250412/slide-016.jpg`
|
||||
|
||||
- Embedded images:
|
||||
- `IMG-ppt03_company_intro_20250412-S016-01`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S016_IMG01.png` (2000x1255)
|
||||
- `IMG-ppt03_company_intro_20250412-S016-02`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S016_IMG02.png` (1000x667)
|
||||
- `IMG-ppt03_company_intro_20250412-S016-03`：`assets/media/ppt03_company_intro_20250412/ppt03_company_intro_20250412_S016_IMG03.png` (317x309)
|
||||
|
||||
Text:
|
||||
|
||||
BZJZ 苏州博志金钻科技有限责任公司 地址：苏州高新区长亭路 8 号大新科技园 3 幢 联系方式： 157 1520 1195 高功率芯片散热材料与封装器件 苏州博志金钻科技有限责任公司 Suzhou Bozhijinzuan
|
||||
Technology.Co.,Ltd 先进的膜层成型技术 / 全链条表面处理方案 / 高品质陶瓷载板与器件
|
||||
@@ -0,0 +1,277 @@
|
||||
---
|
||||
source_type: pptx
|
||||
title: 苏州博志金钻科技有限责任公司介绍 2025-04-15 tc
|
||||
source_path: ../../../博志金钻项目基本情况/※2025_4_15_苏州博志金钻科技有限责任公司介绍（tc）.pptx
|
||||
date_ingested: 2026-06-11-03-46-32
|
||||
slides: 15
|
||||
---
|
||||
|
||||
# 苏州博志金钻科技有限责任公司介绍 2025-04-15 tc
|
||||
|
||||
## Summary
|
||||
|
||||
本页为 PPT 来源笔记，保留逐页文本、幻灯片预览图和内嵌图片索引。稳定结论已提升到 `Knowledge/` 页面；需要复用图片时优先检索 `Sources/Images/图片快速索引.md`。
|
||||
|
||||
## Source
|
||||
|
||||
- 原始文件：`../../../博志金钻项目基本情况/※2025_4_15_苏州博志金钻科技有限责任公司介绍（tc）.pptx`
|
||||
- 入库时间：`2026-06-11-03-46-32`
|
||||
- 幻灯片数量：15
|
||||
|
||||
## Slide Inventory
|
||||
|
||||
### Slide 001: BZJZ
|
||||
|
||||
- Core score: `11`
|
||||
- Preview ID: `SLIDE-ppt04_company_intro_tc_20250415-S001`
|
||||
- Preview path: `assets/slides/ppt04_company_intro_tc_20250415/slide-001.jpg`
|
||||
|
||||
- Embedded images:
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S001-01`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S001_IMG01.png` (2000x1255)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S001-02`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S001_IMG02.png` (1000x667)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S001-03`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S001_IMG03.png` (317x309)
|
||||
|
||||
Text:
|
||||
|
||||
BZJZ 苏州博志金钻科技有限责任公司 地址：苏州高新区长亭路 8 号大新科技园 3 幢 联系方式： 157 1520 1195 高功率芯片散热材料与封装器件 苏州博志金钻科技有限责任公司 Suzhou Bozhijinzuan
|
||||
Technology.Co.,Ltd 先进的膜层成型技术 / 全链条表面处理方案 / 高品质陶瓷载板与器件
|
||||
|
||||
### Slide 002: 创新引领
|
||||
|
||||
- Core score: `25`
|
||||
- Preview ID: `SLIDE-ppt04_company_intro_tc_20250415-S002`
|
||||
- Preview path: `assets/slides/ppt04_company_intro_tc_20250415/slide-002.jpg`
|
||||
|
||||
- Embedded images:
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S002-01`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S002_IMG01.png` (950x609)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S002-02`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S002_IMG02.png` (1076x700)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S002-03`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S002_IMG03.png` (1073x700)
|
||||
|
||||
Text:
|
||||
|
||||
创新引领 前沿技术 重新定义先进材料 始于 1970 年代的五代研发传承 全球领先 的技 术 权威认证的高新技术企业 开拓创新，引领下一代技术 研发能力：国家级研发中心、中国科学院院士团队 研发历程： 15 年 批量稳定出货能力
|
||||
驱动共同成长 全流程可控的稳健产能 超过 1W 平方米的制造基地 可扩展的高良率生产线 经过验证的工艺优化体系 员工人数： 90 人 专利数量： 4 0 余项 公司估值： 8 亿 人民币 高端散热封装产品体系 赋能高功率产业前沿
|
||||
核心产品：高功率芯片热管理封装材料与器件 TEC 载板 | 激光散热器 | 光通信载板 | 传感器载板 以客户为中心的产品与服务 应用场景：光通信模块 | 激光器 | 传感器 | 数据中心 | 射频系统 苏州工厂 南通工厂 研发实验室
|
||||
公司简介
|
||||
|
||||
### Slide 003: 芯片结构、发展趋势与重大挑战
|
||||
|
||||
- Core score: `12`
|
||||
- Preview ID: `SLIDE-ppt04_company_intro_tc_20250415-S003`
|
||||
- Preview path: `assets/slides/ppt04_company_intro_tc_20250415/slide-003.jpg`
|
||||
|
||||
|
||||
Text:
|
||||
|
||||
芯片结构、发展趋势与重大挑战 功率器件芯片、传感器芯片、光通讯芯片、运算存储芯片 芯片 绝缘材料为基底、通过金属布线满足芯片贴片及电信号传输功能 载板 能够快速进行热传导，将热量从一面传导到另一面 ， 实现制冷 与精准温控 主动散热器件
|
||||
热传导能力强、且吸热温度不会剧烈上升的材料 起到暂存储热量的 作用 热沉 通过结构设计和翅片、配合风冷水冷的方式将热量传送到外部 换热器 典型的芯片散热封装结构 热膨胀系数匹配、高导热 高 密度 电信号传导、轻量化 换热器 热沉 TEC
|
||||
载板 Die
|
||||
|
||||
### Slide 004: 产品管线
|
||||
|
||||
- Core score: `10`
|
||||
- Preview ID: `SLIDE-ppt04_company_intro_tc_20250415-S004`
|
||||
- Preview path: `assets/slides/ppt04_company_intro_tc_20250415/slide-004.jpg`
|
||||
|
||||
- Embedded images:
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S004-01`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S004_IMG01.png` (528x436)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S004-02`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S004_IMG02.png` (1287x946)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S004-03`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S004_IMG03.png` (1920x1080)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S004-04`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S004_IMG04.jpeg` (611x436)
|
||||
|
||||
Text:
|
||||
|
||||
产品管线 芯片封装器件的制备核心是解决不同材料间异质界面的问题 陶瓷具有高热导和优良电气性能，通过高密度高精度金属布线，实现芯片直接贴片，满足芯片的高散热和大电流传输的需求。 基体材料：氮化铝 AlN 、氧化铝 Al 2 O 3
|
||||
、单晶金刚石、聚晶金刚石 金属化方案： Ti/Cu/Ni/Pd/Au 、 Ti/Pt/Au 稳定量产阶段 陶瓷载板 金刚石 – 金属复合材料 金刚石铜 金刚石银 金刚石铝 中试阶段 散热垫片（热的填充物） 铝碳化硅 AlSiC 覆铜垫片
|
||||
陶瓷覆铜垫片 中试阶段 新一代封装方式 TGV 玻璃芯片载板 金属覆陶瓷载板 研发阶段
|
||||
|
||||
### Slide 005: 产品
|
||||
|
||||
- Core score: `16`
|
||||
- Preview ID: `SLIDE-ppt04_company_intro_tc_20250415-S005`
|
||||
- Preview path: `assets/slides/ppt04_company_intro_tc_20250415/slide-005.jpg`
|
||||
|
||||
- Embedded images:
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S005-01`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S005_IMG01.png` (559x561)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S005-02`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S005_IMG02.png` (667x661)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S005-03`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S005_IMG03.jpeg` (385x216)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S005-04`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S005_IMG04.png` (4000x2641)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S005-05`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S005_IMG05.png` (416x296)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S005-06`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S005_IMG06.png` (426x260)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S005-07`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S005_IMG07.png` (344x261)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S005-08`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S005_IMG08.png` (622x419)
|
||||
|
||||
Text:
|
||||
|
||||
产品 陶瓷载板 TEC 载板 激光热沉 光通讯载板 陶瓷覆铜板 传感器 图像传感器 | 红外传感器 压力传感器 | 气体传感器 光通讯模块 400G | 800G | 1.6T 激光器件 单管激光器 功率＞ 35W+ 热电制冷器件 光通信
|
||||
| 医疗健康 | 汽车级应用 Annual sales revenue/ million 3 30 亿元 陶瓷载板 市场规模 月产能：三寸片 50K Panel / 单科颗 5kk-20kk PCS
|
||||
|
||||
### Slide 006: 产品
|
||||
|
||||
- Core score: `6`
|
||||
- Preview ID: `SLIDE-ppt04_company_intro_tc_20250415-S006`
|
||||
- Preview path: `assets/slides/ppt04_company_intro_tc_20250415/slide-006.jpg`
|
||||
|
||||
- Embedded images:
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S006-01`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S006_IMG01.png` (2105x961)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S006-02`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S006_IMG02.png` (2105x965)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S006-03`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S006_IMG03.png` (2105x965)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S006-04`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S006_IMG04.png` (1778x815)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S006-05`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S006_IMG05.jpeg` (467x230)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S006-06`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S006_IMG06.jpeg` (307x230)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S006-07`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S006_IMG07.png` (1106x617)
|
||||
|
||||
Text:
|
||||
|
||||
产品 陶瓷载板 - 应用领域：激光器 | 数据中心 | 射频系统 Substrate Sputtering Ti/Cu Dry Film Exposure & Developing Etching Ti/Cu Dry Film
|
||||
Stripping Thick Dry Film Exposure & Developing Electrocoppering Grinding Dry Film Stripping Electrolytic Ni/Au Dry Film
|
||||
Exposure & Developing Evaporating AuSn Dry Film Stripping Dicing Saw Inspection Packing & Delivery DPC 载板加工流程 单晶金刚石载板
|
||||
氮化铝载板 聚晶金刚石载板 DPC 载板（ Direct Plated Copper ）
|
||||
|
||||
### Slide 007: 方能演亦
|
||||
|
||||
- Core score: `10`
|
||||
- Preview ID: `SLIDE-ppt04_company_intro_tc_20250415-S007`
|
||||
- Preview path: `assets/slides/ppt04_company_intro_tc_20250415/slide-007.jpg`
|
||||
|
||||
- Embedded images:
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S007-01`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S007_IMG01.png` (549x451)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S007-02`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S007_IMG02.png` (346x357)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S007-03`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S007_IMG03.jpeg` (327x184)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S007-04`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S007_IMG04.png` (343x184)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S007-05`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S007_IMG05.jpeg` (327x184)
|
||||
|
||||
Text:
|
||||
|
||||
方能演亦 Substrate Evaporating Ti/Pt/Au Spin-on PR Coating Exposure & Developing Packing & Delivery Inspection PR Stripping
|
||||
Etching Ti/Pt/Au TFC 载板 —— 蚀刻工艺 方能演亦 Substrate Spin-on PR Coating Exposure & Developing Evaporating Ti/Pt/Au Packing &
|
||||
Delivery Inspection PR Stripping TFC 载板 —— 剥离工艺 产品 陶瓷载板 - 应用领域：光通讯模块 | 传感器 TFC 载板（ Thin Film Ceramic Substrate ）
|
||||
|
||||
### Slide 008: 生产能力
|
||||
|
||||
- Core score: `2`
|
||||
- Preview ID: `SLIDE-ppt04_company_intro_tc_20250415-S008`
|
||||
- Preview path: `assets/slides/ppt04_company_intro_tc_20250415/slide-008.jpg`
|
||||
|
||||
- Embedded images:
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S008-01`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S008_IMG01.png` (250x251)
|
||||
|
||||
Text:
|
||||
|
||||
生产能力 陶瓷 载板 金刚石 - 金属复合 材料 散热 垫片 新一代 封装材料 机加工 激光加工 PVD 粉末烧结 光刻 电镀 化镀 切割
|
||||
|
||||
### Slide 009: 设备
|
||||
|
||||
- Core score: `10`
|
||||
- Preview ID: `SLIDE-ppt04_company_intro_tc_20250415-S009`
|
||||
- Preview path: `assets/slides/ppt04_company_intro_tc_20250415/slide-009.jpg`
|
||||
|
||||
- Embedded images:
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S009-01`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S009_IMG01.jpeg` (341x262)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S009-02`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S009_IMG02.png` (426x327)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S009-03`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S009_IMG03.png` (427x286)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S009-04`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S009_IMG04.png` (427x287)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S009-05`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S009_IMG05.jpeg` (341x229)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S009-06`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S009_IMG06.jpeg` (341x229)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S009-07`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S009_IMG07.jpeg` (341x261)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S009-08`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S009_IMG08.jpeg` (341x262)
|
||||
|
||||
Text:
|
||||
|
||||
设备 生产设备 核心设备自主设计定制，拥有独立知识产权 率先拉通陶瓷载板全道生产工艺，全部生产环节自主可控 通过 ISO 三体系认证，一万平米生产车间落实 5S 管理 通过多个行业龙头客户审核，获得 20 余家龙头企业供应商资质
|
||||
|
||||
### Slide 010: 设备
|
||||
|
||||
- Core score: `2`
|
||||
- Preview ID: `SLIDE-ppt04_company_intro_tc_20250415-S010`
|
||||
- Preview path: `assets/slides/ppt04_company_intro_tc_20250415/slide-010.jpg`
|
||||
|
||||
- Embedded images:
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S010-01`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S010_IMG01.png` (1440x1080)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S010-02`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S010_IMG02.png` (1440x1080)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S010-03`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S010_IMG03.jpeg` (422x294)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S010-04`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S010_IMG04.png` (1440x1080)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S010-05`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S010_IMG05.jpeg` (421x345)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S010-06`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S010_IMG06.jpeg` (442x237)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S010-07`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S010_IMG07.jpeg` (422x237)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S010-08`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S010_IMG08.jpeg` (421x237)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S010-09`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S010_IMG09.png` (1440x1080)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S010-10`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S010_IMG10.jpeg` (422x308)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S010-11`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S010_IMG11.jpeg` (422x279)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S010-12`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S010_IMG12.jpeg` (416x312)
|
||||
|
||||
Text:
|
||||
|
||||
设备 研发检验设备 划痕仪 X-ray 测厚仪 动态力学分析仪 二次元影像仪 原子吸收分光光度计 同步热分析仪 扫描电子显微镜 电荷分析系统 差示扫描量热仪 拉力试验机 半导体泵浦纳秒激光器 电感耦合等离子体质谱仪
|
||||
|
||||
### Slide 011: 荣誉与资质
|
||||
|
||||
- Core score: `4`
|
||||
- Preview ID: `SLIDE-ppt04_company_intro_tc_20250415-S011`
|
||||
- Preview path: `assets/slides/ppt04_company_intro_tc_20250415/slide-011.jpg`
|
||||
|
||||
- Embedded images:
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S011-01`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S011_IMG01.png` (545x247)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S011-02`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S011_IMG02.png` (7089x4726)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S011-03`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S011_IMG03.png` (800x561)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S011-04`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S011_IMG04.png` (800x562)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S011-05`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S011_IMG05.png` (479x319)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S011-06`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S011_IMG06.png` (653x933)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S011-07`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S011_IMG07.png` (745x1048)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S011-08`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S011_IMG08.png` (655x931)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S011-09`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S011_IMG09.png` (660x928)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S011-10`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S011_IMG10.png` (593x838)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S011-11`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S011_IMG11.jpeg` (1654x2339)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S011-12`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S011_IMG12.jpeg` (1654x2339)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S011-13`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S011_IMG13.jpeg` (1654x2339)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S011-14`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S011_IMG14.png` (479x679)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S011-15`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S011_IMG15.png` (483x683)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S011-16`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S011_IMG16.png` (800x561)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S011-17`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S011_IMG17.jpeg` (800x559)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S011-18`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S011_IMG18.jpeg` (800x560)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S011-19`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S011_IMG19.jpeg` (800x532)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S011-20`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S011_IMG20.png` (541x272)
|
||||
|
||||
Text:
|
||||
|
||||
荣誉与资质 方能演亦 研发实力强大 中科院士领衔技术顾问 16 名全职研发人员 40 多项发明专利 独立授权许可 体系合规认证 荣誉资质 环保许可 能碳许可 ISO9001 、 14001 、 45001 RoHS REACH
|
||||
|
||||
### Slide 012: BZJZ
|
||||
|
||||
- Core score: `12`
|
||||
- Preview ID: `SLIDE-ppt04_company_intro_tc_20250415-S012`
|
||||
- Preview path: `assets/slides/ppt04_company_intro_tc_20250415/slide-012.jpg`
|
||||
|
||||
- Embedded images:
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S012-01`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S012_IMG01.png` (2000x1255)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S012-02`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S012_IMG02.png` (1000x667)
|
||||
- `IMG-ppt04_company_intro_tc_20250415-S012-03`：`assets/media/ppt04_company_intro_tc_20250415/ppt04_company_intro_tc_20250415_S012_IMG03.png` (317x309)
|
||||
|
||||
Text:
|
||||
|
||||
BZJZ 苏州博志金钻科技有限责任公司 地址：苏州高新区长亭路 8 号大新科技园 3 幢 联系方式： 157 1520 1195 高功率芯片散热材料与封装器件 苏州博志金钻科技有限责任公司 Suzhou Bozhijinzuan
|
||||
Technology.Co.,Ltd 先进的膜层成型技术 / 全链条表面处理方案 / 高品质陶瓷载板与器件
|
||||
|
||||
### Slide 013: Slide 13
|
||||
|
||||
- Core score: `0`
|
||||
|
||||
Text:
|
||||
|
||||
（本页未抽取到可编辑文本，需查看预览图。）
|
||||
|
||||
### Slide 015: Slide 15
|
||||
|
||||
- Core score: `0`
|
||||
|
||||
Text:
|
||||
|
||||
（本页未抽取到可编辑文本，需查看预览图。）
|
||||
|
||||
### Slide 016: Slide 16
|
||||
|
||||
- Core score: `0`
|
||||
|
||||
Text:
|
||||
|
||||
（本页未抽取到可编辑文本，需查看预览图。）
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Reference in New Issue
Block a user