# SMA 2026 English Pitch Deck Outline Deck goal: answer Samsung Mobile Advance judges' three questions: innovation, value added to Samsung Mobile devices, and feasibility for a six-month PoC. Recommended title: > Diamond Thermal Packaging Modules for Next-Generation Samsung Mobile Devices ## Slide 1 - Cover Title: Diamond Thermal Packaging Modules for Next-Generation Samsung Mobile Devices Subtitle: Samsung Mobile Advance 2026 Proposal Company: Suzhou Bozhi Jinzhuan Technology Co., Ltd. Key message: from diamond thermal materials to evaluable mobile packaging modules. ## Slide 2 - Project Summary Headline: A six-month PoC to validate diamond-based heat spreading in mobile-scale packages. Copy: - We propose to develop and test diamond-based thermal packaging modules for Samsung Mobile use cases. - The PoC will compare diamond heat spreaders / diamond-metal submounts against conventional thermal stacks under Samsung-defined power and space constraints. - Final deliverables include sample coupons, one demonstrator module, test report, and integration recommendations. ## Slide 3 - Why Samsung Mobile Headline: Mobile innovation is becoming thermally constrained. Three pressure points: - On-device AI and high-performance APs increase local heat flux. - XR, foldable and wearable devices have tighter thermal envelopes. - Camera, sensor and optical modules require thermal stability, not only peak cooling. SMA fit: AI, XR, Power, Foldable, Wearable, Sensors, Materials. ## Slide 4 - Company Information Headline: Bozhi Jinzhuan is an engineering platform for high-power chip thermal packaging. Content: - Core products: high-power chip thermal-management packaging materials and devices. - Existing products: ceramic substrates, TEC substrates, laser heat sinks, optical communication substrates, sensor substrates. - Manufacturing base: over 10,000 m2 manufacturing footprint in company PPT materials. - Capability foundation: PVD, photolithography, electroplating, electroless plating, cutting, inspection and customized metallization. Note: employee count, valuation and patent quantity should be checked before final external submission. ## Slide 5 - Core Technology Headline: The differentiator is the interface, not only the diamond. Technology stack: - Diamond / diamond-metal thermal material. - Surface activation and metallization. - Fine patterning and solder / bonding compatibility. - Package-level thermal path design. - Inspection, reliability feedback and manufacturing iteration. Evidence points: - Company process capability includes Ti, TiW, Ni, Cr, Cu, Ta sputtering and 5/5 um line/space capability in existing audit materials. - Diamond project materials include ultra-thin CVD diamond heat spreaders, diamond package substrates and diamond-Cu composites. ## Slide 6 - Two Integration Routes Headline: Two practical routes for Samsung Mobile evaluation. Route A: Chip-on-diamond submount - Die mounted directly on metallized diamond substrate. - Suitable for XR optical engine, laser/LED, sensor, high-power module. - Output: diamond submount coupon with solder / wire-bond compatible metallization. Route B: Diamond layer in thermal stack - Diamond heat spreader or diamond-metal insert integrated with VC / graphite / TEC / frame. - Suitable for AP hotspot, foldable thin space, wearable module. - Output: thin diamond heat spreader coupon and stack-level thermal comparison. ## Slide 7 - Performance Evidence Headline: Literature and company data support a measurable thermal advantage. Evidence: - Company material deck: ultra-thin CVD diamond heat spreader, 10-150 um, 1600-1800 W/mK. - Company material deck: diamond-Cu composite, 600-800 W/mK, CTE 5-10 ppm/K. - Literature MD: copper-coated diamond/Cu SLM composite reached 336 W/mK at 1 vol.% diamond under optimized process parameters. - Literature MD: CVD diamond membranes can be fabricated as free-standing films; metallization literature supports Au/Cr and Au/Ti-W adhesion and thermal processing windows. - Competitor benchmark: Element Six and Coherent both position CVD diamond as a high-power-density thermal management solution. Use caution: literature values are not direct product guarantees; they support feasibility and mechanism. ## Slide 8 - Application Concept 1: AP / XR Hotspot Headline: Reduce hotspot temperature without redesigning the entire thermal system. Scenario: - Heat source: AP / NPU / XR optical module. - Constraint: high heat flux, thin z-height, limited spreading area. - Proposed module: metallized diamond heat spreader or diamond-Cu submount between die and existing spreader path. PoC test: - Dummy heat source + baseline stack vs. diamond stack. - Metrics: peak temperature, thermal resistance, temperature uniformity, thickness impact. ## Slide 9 - Application Concept 2: Sensor / Camera / Wearable Stability Headline: Use high thermal conductivity and low CTE to stabilize precision modules. Scenario: - Heat from AP, PMIC, camera actuator, optical engine or sensor readout can cause drift. - Diamond package substrate can spread heat and reduce local thermal gradients. PoC test: - Sensor/camera module coupon with controlled heat source. - Metrics: thermal gradient, module drift proxy, thermal cycling stability, warpage. ## Slide 10 - Six-Month PoC Plan Headline: A focused PoC with three evaluation gates. Milestone 1 - Detailed design and review, Month 1-2: - Select target use case with Samsung. - Freeze baseline stack, dimensions, power condition and KPIs. - Deliver design review package and sample drawings. Milestone 2 - Sample build and early working review, Month 3-4: - Fabricate diamond heat spreader / submount coupons. - Complete metallization and assembly process. - Deliver early thermal data and manufacturability feedback. Milestone 3 - TRL 6/7 demonstrator, Month 5-6: - Build final demonstrator module. - Complete thermal comparison, reliability screening and integration recommendation. - Demo to Samsung Mobile R&D. ## Slide 11 - Samsung Support Required Headline: We can execute independently; Samsung input will sharpen the PoC. Requested support: - Target device class and rough mechanical envelope. - Baseline material stack or reference thermal coupon. - Power map / heat source assumption for dummy testing. - Loan device or non-confidential module sample if available. - Review access to Samsung R&D thermal / packaging owner at milestone gates. No dependency: - The PoC can proceed with dummy heat source and public mechanical assumptions if device data is not available. ## Slide 12 - Expected Value Headline: A fast path to evaluate diamond thermal packaging inside Samsung Mobile architectures. Expected Samsung value: - Lower hotspot temperature under thin, constrained mobile geometry. - More stable sensors, optical modules and power modules. - New material option for AI, XR, foldable and wearable roadmaps. - A manufacturing partner able to move from material coupons to package-level modules. Closing: > We invite Samsung Mobile to co-define the most valuable target module and validate diamond thermal packaging within a six-month PoC.