Backup diamond thermal project materials

金刚石散热项目/SMA2026英文路演PPT大纲.md

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+# SMA 2026 English Pitch Deck Outline
+
+Deck goal: answer Samsung Mobile Advance judges' three questions: innovation, value added to Samsung Mobile devices, and feasibility for a six-month PoC.
+
+Recommended title:
+
+> Diamond Thermal Packaging Modules for Next-Generation Samsung Mobile Devices
+
+## Slide 1 - Cover
+
+Title: Diamond Thermal Packaging Modules for Next-Generation Samsung Mobile Devices
+
+Subtitle: Samsung Mobile Advance 2026 Proposal
+
+Company: Suzhou Bozhi Jinzhuan Technology Co., Ltd.
+
+Key message: from diamond thermal materials to evaluable mobile packaging modules.
+
+## Slide 2 - Project Summary
+
+Headline: A six-month PoC to validate diamond-based heat spreading in mobile-scale packages.
+
+Copy:
+
+- We propose to develop and test diamond-based thermal packaging modules for Samsung Mobile use cases.
+- The PoC will compare diamond heat spreaders / diamond-metal submounts against conventional thermal stacks under Samsung-defined power and space constraints.
+- Final deliverables include sample coupons, one demonstrator module, test report, and integration recommendations.
+
+## Slide 3 - Why Samsung Mobile
+
+Headline: Mobile innovation is becoming thermally constrained.
+
+Three pressure points:
+
+- On-device AI and high-performance APs increase local heat flux.
+- XR, foldable and wearable devices have tighter thermal envelopes.
+- Camera, sensor and optical modules require thermal stability, not only peak cooling.
+
+SMA fit: AI, XR, Power, Foldable, Wearable, Sensors, Materials.
+
+## Slide 4 - Company Information
+
+Headline: Bozhi Jinzhuan is an engineering platform for high-power chip thermal packaging.
+
+Content:
+
+- Core products: high-power chip thermal-management packaging materials and devices.
+- Existing products: ceramic substrates, TEC substrates, laser heat sinks, optical communication substrates, sensor substrates.
+- Manufacturing base: over 10,000 m2 manufacturing footprint in company PPT materials.
+- Capability foundation: PVD, photolithography, electroplating, electroless plating, cutting, inspection and customized metallization.
+
+Note: employee count, valuation and patent quantity should be checked before final external submission.
+
+## Slide 5 - Core Technology
+
+Headline: The differentiator is the interface, not only the diamond.
+
+Technology stack:
+
+- Diamond / diamond-metal thermal material.
+- Surface activation and metallization.
+- Fine patterning and solder / bonding compatibility.
+- Package-level thermal path design.
+- Inspection, reliability feedback and manufacturing iteration.
+
+Evidence points:
+
+- Company process capability includes Ti, TiW, Ni, Cr, Cu, Ta sputtering and 5/5 um line/space capability in existing audit materials.
+- Diamond project materials include ultra-thin CVD diamond heat spreaders, diamond package substrates and diamond-Cu composites.
+
+## Slide 6 - Two Integration Routes
+
+Headline: Two practical routes for Samsung Mobile evaluation.
+
+Route A: Chip-on-diamond submount
+
+- Die mounted directly on metallized diamond substrate.
+- Suitable for XR optical engine, laser/LED, sensor, high-power module.
+- Output: diamond submount coupon with solder / wire-bond compatible metallization.
+
+Route B: Diamond layer in thermal stack
+
+- Diamond heat spreader or diamond-metal insert integrated with VC / graphite / TEC / frame.
+- Suitable for AP hotspot, foldable thin space, wearable module.
+- Output: thin diamond heat spreader coupon and stack-level thermal comparison.
+
+## Slide 7 - Performance Evidence
+
+Headline: Literature and company data support a measurable thermal advantage.
+
+Evidence:
+
+- Company material deck: ultra-thin CVD diamond heat spreader, 10-150 um, 1600-1800 W/mK.
+- Company material deck: diamond-Cu composite, 600-800 W/mK, CTE 5-10 ppm/K.
+- Literature MD: copper-coated diamond/Cu SLM composite reached 336 W/mK at 1 vol.% diamond under optimized process parameters.
+- Literature MD: CVD diamond membranes can be fabricated as free-standing films; metallization literature supports Au/Cr and Au/Ti-W adhesion and thermal processing windows.
+- Competitor benchmark: Element Six and Coherent both position CVD diamond as a high-power-density thermal management solution.
+
+Use caution: literature values are not direct product guarantees; they support feasibility and mechanism.
+
+## Slide 8 - Application Concept 1: AP / XR Hotspot
+
+Headline: Reduce hotspot temperature without redesigning the entire thermal system.
+
+Scenario:
+
+- Heat source: AP / NPU / XR optical module.
+- Constraint: high heat flux, thin z-height, limited spreading area.
+- Proposed module: metallized diamond heat spreader or diamond-Cu submount between die and existing spreader path.
+
+PoC test:
+
+- Dummy heat source + baseline stack vs. diamond stack.
+- Metrics: peak temperature, thermal resistance, temperature uniformity, thickness impact.
+
+## Slide 9 - Application Concept 2: Sensor / Camera / Wearable Stability
+
+Headline: Use high thermal conductivity and low CTE to stabilize precision modules.
+
+Scenario:
+
+- Heat from AP, PMIC, camera actuator, optical engine or sensor readout can cause drift.
+- Diamond package substrate can spread heat and reduce local thermal gradients.
+
+PoC test:
+
+- Sensor/camera module coupon with controlled heat source.
+- Metrics: thermal gradient, module drift proxy, thermal cycling stability, warpage.
+
+## Slide 10 - Six-Month PoC Plan
+
+Headline: A focused PoC with three evaluation gates.
+
+Milestone 1 - Detailed design and review, Month 1-2:
+
+- Select target use case with Samsung.
+- Freeze baseline stack, dimensions, power condition and KPIs.
+- Deliver design review package and sample drawings.
+
+Milestone 2 - Sample build and early working review, Month 3-4:
+
+- Fabricate diamond heat spreader / submount coupons.
+- Complete metallization and assembly process.
+- Deliver early thermal data and manufacturability feedback.
+
+Milestone 3 - TRL 6/7 demonstrator, Month 5-6:
+
+- Build final demonstrator module.
+- Complete thermal comparison, reliability screening and integration recommendation.
+- Demo to Samsung Mobile R&D.
+
+## Slide 11 - Samsung Support Required
+
+Headline: We can execute independently; Samsung input will sharpen the PoC.
+
+Requested support:
+
+- Target device class and rough mechanical envelope.
+- Baseline material stack or reference thermal coupon.
+- Power map / heat source assumption for dummy testing.
+- Loan device or non-confidential module sample if available.
+- Review access to Samsung R&D thermal / packaging owner at milestone gates.
+
+No dependency:
+
+- The PoC can proceed with dummy heat source and public mechanical assumptions if device data is not available.
+
+## Slide 12 - Expected Value
+
+Headline: A fast path to evaluate diamond thermal packaging inside Samsung Mobile architectures.
+
+Expected Samsung value:
+
+- Lower hotspot temperature under thin, constrained mobile geometry.
+- More stable sensors, optical modules and power modules.
+- New material option for AI, XR, foldable and wearable roadmaps.
+- A manufacturing partner able to move from material coupons to package-level modules.
+
+Closing:
+
+> We invite Samsung Mobile to co-define the most valuable target module and validate diamond thermal packaging within a six-month PoC.